Patents by Inventor Deepak Shetty

Deepak Shetty has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104043
    Abstract: Embodiments herein relate to a module which can be inserted into or removed from a computing device by a user. The module includes an input-output port which is configured for a desired specification, such as USB-A, USB-C, Thunderbolt, DisplayPort or HDMI. The port can be provided on an expansion card such as an M.2 card for communicating with a host platform. The host platform can communicate with different types of modules in a standardized way so that complexity and costs are reduced. In another aspect, with a dual port module, the host platform can concurrently send/receive power through one port and send/receive data from the other port.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventors: Shailendra Singh Chauhan, Nirmala Bailur, Reza M. Zamani, Jackson Chung Peng Kong, Charuhasini Sunder Raman, Venkataramani Gopalakrishnan, Chuen Ming Tan, Sreejith Satheesakurup, Karthi Kaliswamy, Venkata Mahesh Gunnam, Yi Jen Huang, Kie Woon Lim, Dhinesh Sasidaran, Pik Shen Chee, Venkataramana Kotakonda, Kunal A. Shah, Ramesh Vankunavath, Siva Prasad Jangili Ganga, Ravali Pampala, Uma Medepalli, Tomer Savariego, Naznin Banu Wahab, Sindhusha Kodali, Manjunatha Venkatarauyappa, Surendar Jeevarathinam, Madhura Shetty, Deepak Sharma, Rohit Sharad Mahajan
  • Patent number: 11073301
    Abstract: A heating, ventilation, and air conditioning (HVAC) system includes a heat pump having a housing. The HVAC system also includes an energy recovery ventilator (ERV) or heat recover ventilator (HRV) integrated with the heat pump such that an access panel to the ERV or HRV faces outwardly from the housing of the heat pump, and such that the access panel is accessible at an outer boundary of the housing.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: July 27, 2021
    Assignee: Johnson Controls Technology Company
    Inventors: Sandeep Singh, Sasa Misaljevic, Nivedita Nath, Deepak Shetty, Biplab Bardhan
  • Publication number: 20190316807
    Abstract: A heating, ventilation, and air conditioning (HVAC) system includes a heat pump having a housing. The HVAC system also includes an energy recovery ventilator (ERV) or heat recover ventilator (HRV) integrated with the heat pump such that an access panel to the ERV or HRV faces outwardly from the housing of the heat pump, and such that the access panel is accessible at an outer boundary of the housing.
    Type: Application
    Filed: April 13, 2018
    Publication date: October 17, 2019
    Inventors: Sandeep Singh, Sasa Misaljevic, Nivedita Nath, Deepak Shetty, Biplab Bardhan
  • Publication number: 20060123153
    Abstract: A method and system for testing a remote I/O sub-assembly. The method including: allocating source memory, destination memory and DMA queue memory location in a memory of the remote I/O sub-assembly; writing a pattern of test data into the source memory location; writing a set of descriptors simulating data transfer commands into the DMA queue memory location; wrapping a first remote I/O port of the remote I/O sub-assembly to a second remote I/O port of the remote I/O sub-assembly with a remote I/O wrap cable; (e) configuring a DMA engine of the remote I/O sub-assembly to point to the DMA queue memory location and to the first and second remote I/O ports; and loading each descriptor of the set of descriptors into the DMA engine and transferring data from the source memory location to the destination memory location based on the descriptors.
    Type: Application
    Filed: November 9, 2004
    Publication date: June 8, 2006
    Applicant: International Business Machines Corporation
    Inventors: Shakti Kapoor, Deepak Shetty