Patents by Inventor Deepak Swamy

Deepak Swamy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10216485
    Abstract: A method and system for real-time analytics of sensor-based data is disclosed. Also disclosed is a Cloud-based Paltform-as-a-Service (PaaS) offering for sensor driven applications with services and features for their complete life-cycle management including prompt development, testing, deployment and so forth. The method of the present disclosure enables real-time tracking of various physical parameters and attributes related to smart-spaces using sensor devices implemented in the premises of the smart-space environment and using crowd-sourced user input data. Further, the parameters obtained are sent to the cloud-computing server, wherein the analytics are performed in real-time based on the obtained parameters.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: February 26, 2019
    Assignee: TATA CONSULTANCY SERVICES LIMITED
    Inventors: Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Deepak Swamy, Venkatramanan Siva Subrahmanian, Debnarayan Kar, Soumitra Naskar, Sumanta Ghosh, Suman Adak
  • Patent number: 9990182
    Abstract: A computing platform for intelligent development, deployment and management of vehicle telemetry applications is disclosed herein. Further, the present disclosure provides a method and system that enables provision of Intelligent Transportation Service on the Cloud-based Platform that facilitates creation and deployment of vehicle telemetry applications configured for enabling traffic measurements, traffic shaping, vehicle surveillance and other vehicle related services.
    Type: Grant
    Filed: September 18, 2012
    Date of Patent: June 5, 2018
    Assignee: TATA CONSULTANCY SERVICES LIMITED
    Inventors: Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Deepak Swamy, Venkatramanan Siva Subrahmanian, Avik Ghose, Aniruddha Sinha
  • Publication number: 20180025458
    Abstract: A self-customizing, multi-tenanted mobile system includes digitally gathering and disseminating real-time visual intelligence on utility asset damage enabling automated priority analysis and enhanced utility outage response. A preferred embodiment may be made up of, for example, communication module (102) to transfer geo-coded damage imaging and associated metadata simultaneously from multiple outage-causing damage locations to dispatchers and operations personnel in the utility control room and in the field. A mobile application (101) is installed onto the first responder's Global Positioning System (GPS) enabled mobile device (104) to send metadata to a multi-tenanted intelligent platform (MTIP) (106). MTIP (106) determines which utility tenant receives the damage report and customizes all aspects of the technical solution: the first responder mobile application (101), the central web portal (103) and the damage viewing application for utility field personnel (110).
    Type: Application
    Filed: July 25, 2017
    Publication date: January 25, 2018
    Inventor: Deepak Swamy
  • Publication number: 20140380264
    Abstract: A computing platform for intelligent development, deployment and management of vehicle telemetry applications is disclosed herein. Further, the present disclosure provides a method and system that enables provision of Intelligent Transportation Service on the Cloud-based Platform that facilitates creation and deployment of vehicle telemetry applications configured for enabling traffic measurements, traffic shaping, vehicle surveillance and other vehicle related services.
    Type: Application
    Filed: September 18, 2012
    Publication date: December 25, 2014
    Applicant: Tata Consultancy Services, Limited
    Inventors: Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Deepak Swamy, Venkatramanan Siva Subrahmanian, Avik Ghose, Aniruddha Sinha
  • Publication number: 20140359552
    Abstract: A method and system for real-time analytics of sensor-based data is disclosed. Also disclosed is a Cloud-based Paltform-as-a-Service (PaaS) offering for sensor driven applications with services and features for their complete life-cycle management including prompt development, testing, deployment and so forth. The method of the present disclosure enables real-time tracking of various physical parameters and attributes related to smart-spaces using sensor devices implemented in the premises of the smart-space environment and using crowd-sourced user input data. Further, the parameters obtained are sent to the cloud-computing server, wherein the analytics are performed in real-time based on the obtained parameters.
    Type: Application
    Filed: September 18, 2012
    Publication date: December 4, 2014
    Inventors: Prateep Misra, Arpan Pal, Balamuralidhar Purushothaman, Chirabrata Bhaumik, Deepak Swamy, Venkatramanan Siva Subrahmanian, Debnarayan Kar, Soumitra Naskar, Sumanta Ghosh, Suman Adak
  • Publication number: 20010012726
    Abstract: A connector suitable for providing an electrical connection between a plurality of modules with card edge connections and the motherboard in a stacked configuration is disclosed. This connector includes a plurality of housings, each containing a socket with contacts suitable for providing an electrical contact between a module and the motherboard. These housings are stacked in a direction normal to the surface on which the connector is mounted, such as the motherboard. These housings can also be offset with respect to each other such that the modules are secured to the connector in a stacked and stepped configuration.
    Type: Application
    Filed: October 14, 1999
    Publication date: August 9, 2001
    Inventors: SEAN P. O'NEAL, REYNOLD L. LIAO, DEEPAK SWAMY
  • Patent number: 6035350
    Abstract: A trackpad or other input/output device is detachable from a computer and adapted with a remote communication functionality using radio frequency (RF) or infrared (IR) technologies, thereby facilitating the performance of slide presentations and other graphic displays. A remote presentation capability allows a computer user to conveniently address a group from a position at a suitable location, such as a podium, that is removed from the computer system. A remote interface includes a trackpad or other input/output device and activation buttons. The input/output device is housed in a small removable enclosure which is adapted for docking into an aperture in the computer. The input/output device is rechargeable with a charger installed into the computer so that the input/output device is recharged during docking with the computer.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: March 7, 2000
    Assignee: Dell USA, L.P.
    Inventors: N. Deepak Swamy, Robert L. McMahan
  • Patent number: 5946544
    Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.
    Type: Grant
    Filed: November 22, 1996
    Date of Patent: August 31, 1999
    Assignee: Dell USA, L.P.
    Inventors: Scott Estes, Deepak Swamy
  • Patent number: 5935244
    Abstract: The present invention provides a personal computer system for receiving and retaining data and capable of securing data retained within the system against unauthorized access. More particularly, the system includes a computer including a processor and a detachable input/output (I/O) device that functions as a conventional computer interface when docked to the computer and wherein the computer system enters a suspend mode when the detachable I/O device is detached from the computer whereby the system data is secured against unauthorized access. A security module controls access to at least certain levels of data retained within the system by distinguishing between the detachable I/O device docked to the computer and the detachable I/O device detached from the computer. A docking station is coupled to the processor and is detachably coupled to the detachable I/O device.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: August 10, 1999
    Assignee: Dell USA, L.P.
    Inventors: N. Deepak Swamy, Robert L. McMahan
  • Patent number: 5847951
    Abstract: An integrated circuit package comprising an integrated circuit device and a voltage converter circuit both embedded within the package. The voltage converter circuit is configured to convert a standard supply voltage to an operating voltage as required by the integrated circuit device. Also, discrete embedded capacitors may be included to capacitively couple power and ground connections of the integrated circuit device and thus reduce voltage variations during operation of the integrated circuit device. The integrated circuit may package include one or more layers. One or more discrete components or integrated circuits are mounted to one or more layers within the package. Internal conductors on one or more of the layers are configured to connect the components forming the voltage converter circuit. Internal conductors also form connections to the integrated circuit device. The integrated circuit device and voltage converter circuit may be coated with an encapsulant for added protection.
    Type: Grant
    Filed: December 16, 1996
    Date of Patent: December 8, 1998
    Assignee: Dell USA, L.P.
    Inventors: Alan E. Brown, N. Deepak Swamy
  • Patent number: 5835357
    Abstract: A ceramic package for an integrated circuit (IC) and a method of manufacturing the ceramic package.
    Type: Grant
    Filed: September 5, 1995
    Date of Patent: November 10, 1998
    Assignee: Dell USA, L.P.
    Inventors: Deepak Swamy, Thomas J. Kocis
  • Patent number: 5714789
    Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.
    Type: Grant
    Filed: November 22, 1996
    Date of Patent: February 3, 1998
    Assignee: Dell U.S.A., L.P.
    Inventors: Scott Estes, Deepak Swamy
  • Patent number: 5675183
    Abstract: A hybrid multichip module and method for fabricating same provides a cost-effective interconnection of semiconductor chips combining the advantages of modern MCM-D technology with modern MCM-L technology. In a preferred embodiment, the hybrid multichip module has semiconductor chips mounted to an MCM-D structure and interconnected by an MCM-L structure via solder columns.
    Type: Grant
    Filed: July 12, 1995
    Date of Patent: October 7, 1997
    Inventors: Deepak Swamy, David Lunsford
  • Patent number: 5625227
    Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.
    Type: Grant
    Filed: January 18, 1995
    Date of Patent: April 29, 1997
    Assignee: Dell USA, L.P.
    Inventors: Scott Estes, Deepak Swamy
  • Patent number: 5623594
    Abstract: A system and method for monitoring the temperature of a heat-producing electronic component located on a circuit board and a method of manufacturing therefor. The system includes: (1) an electrically-conductive trace of predetermined dimensions formed integrally with the circuit board, the trace having a temperature-dependent electrical property, a temperature of the electronic component affecting the electrical property and (2) an overtemperature detection circuit coupled to the trace for measuring the electrical property. The detection circuit provides, in response thereto, an overtemperature signal to thereby indicate that the temperature of the electronic component has exceeded a predetermined level. Preferably, the system is used to protect a microprocessor in a personal computer ("PC") from overheating.
    Type: Grant
    Filed: January 18, 1996
    Date of Patent: April 22, 1997
    Assignee: Dell USA, L.P.
    Inventor: Deepak Swamy
  • Patent number: 5613858
    Abstract: A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.
    Type: Grant
    Filed: July 18, 1996
    Date of Patent: March 25, 1997
    Assignee: Dell U.S.A., L.P.
    Inventors: Scott H. Estes, N. Deepak Swamy
  • Patent number: 5613033
    Abstract: An interconnect system is provided in which one or more laminated modules embodying electrical devices can be stacked in a three dimensional configuration upon a printed circuit board. One or more electrical devices is surface mounted to a recessed area at the upper surface of each laminated module, and each laminated module includes male pins and female sockets. The male pins can be releasibly engaged within sockets upon a printed circuit board. Additionally, the male pins of one laminated module can be engaged within female sockets of another laminated module in building-block fashion. Conductive paths are formed entirely through the laminated module between respective sockets and pins. The conductive paths are arranged in a less dense fashion than bond locations adjacent each electrical device. The bond locations are therefore offset from conductive paths to provide fan-out and redistribution features.
    Type: Grant
    Filed: January 18, 1995
    Date of Patent: March 18, 1997
    Assignee: Dell USA, LP
    Inventors: N. Deepak Swamy, Tom J. Kocis
  • Patent number: 5593322
    Abstract: A leadless high density connector including a plurality of connector pins each having multiconductor pins electrically connected to solder balls on the back side of the connector for interconnection to a PWB. The solder balls form a ball grid array (BGA), which replaces thin gull wing leads used on connectors of prior art. The use of BGA technology as applied to high density connectors provides a plurality of benefits associated with BGA technology. The signal carrying capacity of the connector is increased since the bottom surface of the connector is available for interconnecting signal paths rather than being limited to the peripheral edges as common for leaded packages. The resulting profile of the connector is substantially reduced allowing increased component and wiring density. The resulting bond strength using BGA technology is greater than that with a leaded equivalent due to the increased bond surface area and resulting anchoring effect.
    Type: Grant
    Filed: January 17, 1995
    Date of Patent: January 14, 1997
    Assignee: Dell USA, L.P.
    Inventors: Deepak Swamy, Victor Pecone
  • Patent number: 5587885
    Abstract: To facilitate the registered connection between a laminated multi chip module and an associated multi-tiered circuit board, spaced series of vias are formed transversely through the circuit board and module substrates between their opposite first and second sides. Gold plated BGA leads, offset from the module substrate vias, are formed on the first module substrate side on multi-layer plating structures disposed thereon and extending along the module via interior side surfaces. A spaced series of relatively shallow, circularly cross-sectioned socket areas, offset from the circuit board vias, are also formed on the first side of the circuit board. The sockets have diameters slightly larger that those of the generally ball-shaped BGA leads of the multi chip module, and are positioned on the same centerline pattern as the leads.
    Type: Grant
    Filed: July 15, 1994
    Date of Patent: December 24, 1996
    Assignee: Dell USA, L.P.
    Inventor: N. Deepak Swamy
  • Patent number: 5571608
    Abstract: An embedded core laminate including a conductive reference plane interposed between two insulation layers, and further interposed between two conductive layers. The assembly is laminated using standard temperature and pressure laminating procedures. Holes for interconnect vias are preferably drilled into the reference plane before laminating. The resulting embedded core laminate has three conductive layers with relatively uniform separation, insuring improved impedance control on each PCB (printed circuit board). Since uniform separation is maintained from one PCB to another, multiple PCBs connected together using embedded core laminates according to the present invention allows minimum cross-talk and characteristic impedance variations from one PCB to the next.
    Type: Grant
    Filed: September 5, 1995
    Date of Patent: November 5, 1996
    Assignee: Dell USA, L.P.
    Inventor: N. Deepak Swamy