Abstract: A self-customizing, multi-tenanted mobile system includes digitally gathering and disseminating real-time visual intelligence on utility asset damage enabling automated priority analysis and enhanced utility outage response. A preferred embodiment may be made up of, for example, communication module (102) to transfer geo-coded damage imaging and associated metadata simultaneously from multiple outage-causing damage locations to dispatchers and operations personnel in the utility control room and in the field. A mobile application (101) is installed onto the first responder's Global Positioning System (GPS) enabled mobile device (104) to send metadata to a multi-tenanted intelligent platform (MTIP) (106). MTIP (106) determines which utility tenant receives the damage report and customizes all aspects of the technical solution: the first responder mobile application (101), the central web portal (103) and the damage viewing application for utility field personnel (110).

Abstract: There are many administrative processes which require a user to enter handwritten data on ordinary paper forms. This data is then further processed and converted in the digitized form. In the existing methods, the turnaround time for whole process is high, lacks accuracy of the digitized data, and cost is also on the higher side. A system and method for real time digitization of hand written input data has been provided. The system comprises an input device that utilizes a pen and paper input form which is filled by a user in his hand writing. The completed form data is then transferred to a form inspector application that runs on the aggregation device. It allows for applications to be verified for completeness and send the same for real-time digitization using a form processor application. A recognition engine is then used for the digitization of the hand written input data.

Abstract: There are many administrative processes which require a user to enter handwritten data on ordinary paper forms. This data is then further processed and converted in the digitized form. In the existing methods, the turnaround time for whole process is high, lacks accuracy of the digitized data, and cost is also on the higher side. A system and method for real time digitization of hand written input data has been provided. The system comprises an input device that utilizes a pen and paper input form which is filled by a user in his hand writing. The completed form data is then transferred to a form inspector application that runs on the aggregation device. It allows for applications to be verified for completeness and send the same for real-time digitization using a form processor application. A recognition engine is then used for the digitization of the hand written input data.

Abstract: A method and system for real-time analytics of sensor-based data is disclosed. Also disclosed is a Cloud-based Paltform-as-a-Service (PaaS) offering for sensor driven applications with services and features for their complete life-cycle management including prompt development, testing, deployment and so forth. The method of the present disclosure enables real-time tracking of various physical parameters and attributes related to smart-spaces using sensor devices implemented in the premises of the smart-space environment and using crowd-sourced user input data. Further, the parameters obtained are sent to the cloud-computing server, wherein the analytics are performed in real-time based on the obtained parameters.

Abstract: A computing platform for intelligent development, deployment and management of vehicle telemetry applications is disclosed herein. Further, the present disclosure provides a method and system that enables provision of Intelligent Transportation Service on the Cloud-based Platform that facilitates creation and deployment of vehicle telemetry applications configured for enabling traffic measurements, traffic shaping, vehicle surveillance and other vehicle related services.

Abstract: A self-customizing, multi-tenanted mobile system includes digitally gathering and disseminating real-time visual intelligence on utility asset damage enabling automated priority analysis and enhanced utility outage response. A preferred embodiment may be made up of, for example, communication module (102) to transfer geo-coded damage imaging and associated metadata simultaneously from multiple outage-causing damage locations to dispatchers and operations personnel in the utility control room and in the field. A mobile application (101) is installed onto the first responder's Global Positioning System (GPS) enabled mobile device (104) to send metadata to a multi-tenanted intelligent platform (MTIP) (106). MTIP (106) determines which utility tenant receives the damage report and customizes all aspects of the technical solution: the first responder mobile application (101), the central web portal (103) and the damage viewing application for utility field personnel (110).

Abstract: A computing platform for intelligent development, deployment and management of vehicle telemetry applications is disclosed herein. Further, the present disclosure provides a method and system that enables provision of Intelligent Transportation Service on the Cloud-based Platform that facilitates creation and deployment of vehicle telemetry applications configured for enabling traffic measurements, traffic shaping, vehicle surveillance and other vehicle related services.

Abstract: A method and system for real-time analytics of sensor-based data is disclosed. Also disclosed is a Cloud-based Paltform-as-a-Service (PaaS) offering for sensor driven applications with services and features for their complete life-cycle management including prompt development, testing, deployment and so forth. The method of the present disclosure enables real-time tracking of various physical parameters and attributes related to smart-spaces using sensor devices implemented in the premises of the smart-space environment and using crowd-sourced user input data. Further, the parameters obtained are sent to the cloud-computing server, wherein the analytics are performed in real-time based on the obtained parameters.

Abstract: A connector suitable for providing an electrical connection between a plurality of modules with card edge connections and the motherboard in a stacked configuration is disclosed. This connector includes a plurality of housings, each containing a socket with contacts suitable for providing an electrical contact between a module and the motherboard. These housings are stacked in a direction normal to the surface on which the connector is mounted, such as the motherboard. These housings can also be offset with respect to each other such that the modules are secured to the connector in a stacked and stepped configuration.

Abstract: A trackpad or other input/output device is detachable from a computer and adapted with a remote communication functionality using radio frequency (RF) or infrared (IR) technologies, thereby facilitating the performance of slide presentations and other graphic displays. A remote presentation capability allows a computer user to conveniently address a group from a position at a suitable location, such as a podium, that is removed from the computer system. A remote interface includes a trackpad or other input/output device and activation buttons. The input/output device is housed in a small removable enclosure which is adapted for docking into an aperture in the computer. The input/output device is rechargeable with a charger installed into the computer so that the input/output device is recharged during docking with the computer.

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.

Abstract: The present invention provides a personal computer system for receiving and retaining data and capable of securing data retained within the system against unauthorized access. More particularly, the system includes a computer including a processor and a detachable input/output (I/O) device that functions as a conventional computer interface when docked to the computer and wherein the computer system enters a suspend mode when the detachable I/O device is detached from the computer whereby the system data is secured against unauthorized access. A security module controls access to at least certain levels of data retained within the system by distinguishing between the detachable I/O device docked to the computer and the detachable I/O device detached from the computer. A docking station is coupled to the processor and is detachably coupled to the detachable I/O device.

Abstract: An integrated circuit package comprising an integrated circuit device and a voltage converter circuit both embedded within the package. The voltage converter circuit is configured to convert a standard supply voltage to an operating voltage as required by the integrated circuit device. Also, discrete embedded capacitors may be included to capacitively couple power and ground connections of the integrated circuit device and thus reduce voltage variations during operation of the integrated circuit device. The integrated circuit may package include one or more layers. One or more discrete components or integrated circuits are mounted to one or more layers within the package. Internal conductors on one or more of the layers are configured to connect the components forming the voltage converter circuit. Internal conductors also form connections to the integrated circuit device. The integrated circuit device and voltage converter circuit may be coated with an encapsulant for added protection.

Abstract: A ceramic package for an integrated circuit (IC) and a method of manufacturing the ceramic package.

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.

Abstract: A hybrid multichip module and method for fabricating same provides a cost-effective interconnection of semiconductor chips combining the advantages of modern MCM-D technology with modern MCM-L technology. In a preferred embodiment, the hybrid multichip module has semiconductor chips mounted to an MCM-D structure and interconnected by an MCM-L structure via solder columns.

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes.

Abstract: A system and method for monitoring the temperature of a heat-producing electronic component located on a circuit board and a method of manufacturing therefor. The system includes: (1) an electrically-conductive trace of predetermined dimensions formed integrally with the circuit board, the trace having a temperature-dependent electrical property, a temperature of the electronic component affecting the electrical property and (2) an overtemperature detection circuit coupled to the trace for measuring the electrical property. The detection circuit provides, in response thereto, an overtemperature signal to thereby indicate that the temperature of the electronic component has exceeded a predetermined level. Preferably, the system is used to protect a microprocessor in a personal computer ("PC") from overheating.

Abstract: A circuit board structure is provided with a compact switching system for selectively connecting and disconnecting a pair of electrically conductive lead portions thereof. The switching system includes a through hole formed in the substrate portion and extending between its opposite sides. The interior side surface of the through hole is plated with an electrically conductive metal material. Portions of the plating are then removed to leave a mutually spaced plurality of plating segments within the through hole. Each plating segment is connected to an end of one of the circuit board leads. A switch structure is provided and has a contact portion which is insertable into the through hole and movable therein, into and out of engagement with a pair of the spaced plating segments, to selectively and electrically couple the circuit board leads associated with the plating segment pair.

Abstract: An interconnect system is provided in which one or more laminated modules embodying electrical devices can be stacked in a three dimensional configuration upon a printed circuit board. One or more electrical devices is surface mounted to a recessed area at the upper surface of each laminated module, and each laminated module includes male pins and female sockets. The male pins can be releasibly engaged within sockets upon a printed circuit board. Additionally, the male pins of one laminated module can be engaged within female sockets of another laminated module in building-block fashion. Conductive paths are formed entirely through the laminated module between respective sockets and pins. The conductive paths are arranged in a less dense fashion than bond locations adjacent each electrical device. The bond locations are therefore offset from conductive paths to provide fan-out and redistribution features.