Abstract: Systems and methods for producing and maintaining account related triggers are provided herein. The systems and methods may be utilized for risk mitigation. Account triggers may be executed to determine account activity indicative of a risk event. Once a risk event is identified, the financial institution may determine an appropriate action to mitigate foreseeable risk due to the risk event.

Abstract: Systems and methods for providing offers associated with one or more accounts of a financial institution is provided herein. The system receives account data associated with the one or more accounts; stores the account data in a storage device; identifies account activity for at least one of inbound transactions or outbound transactions based on the account data; and identifies triggers comprising opportunities for providing offers based on the account activity. The system then provides an offer to the user based on the trigger. In some embodiments, the trigger is based on inbound transaction but in other embodiments the trigger is based on outbound transactions. The offer can be specifically related to another party associated with the trigger, e.g., the recipient of a payment, or the offer can be based on the time, amount, or location of the trigger. A computer program product is also provided.

Abstract: Systems and methods for increasing transaction depth and account breadth are provided herein. In the systems and methods, account data associated with one or more account are received and the account data is stored in a storage device; a first trigger group comprising a number of transactions occurring during a first period of time and a second trigger group comprising a number of transactions occurring during a second period of time based on the account data are identified based on the account data; the first trigger group and the second trigger group are compared; and an increase in account activity for each of the one or more accounts is determined in response to the comparison of the first trigger group and second trigger group.

Abstract: Systems and methods for monitoring trigger data quality are provided herein. The systems and methods detect and report whether the current trigger counts are normal or flawed in real time. The systems and methods monitor the triggers to determine the accuracy, completeness, domain of values, and format of the trigger data. In the system and methods, account data associated with the one or more accounts is received and stored in a storage device; the account data is segregated into one or more periods of time; triggers associated with the one or more periods of time are identified based on transactions that occur during the one or more periods of time; a total transaction count for each of the triggers is calculated; and control limits are determined based on the transaction count for each of the triggers.

Abstract: Systems and methods for producing and maintaining account related triggers are provided herein. The systems and methods may be utilized for triggering offers based on financial information of one or more accounts of a financial institution customer. Triggers may be executed to monitor hardship trends. If a hardship is identified, the financial institution may present a hardship offer to the customer for assistance.

Abstract: Systems and methods for producing and maintaining account related triggers are provided herein. The systems and methods may be utilized for monitoring of one or more accounts of a financial institution. Triggers may be executed to monitor financial account ratios. Offers may be triggered based on the account ratios or changes in the account ratios.

Abstract: Systems and methods for retaining users in their existing relationship with a financial institution are provided herein. Based on account data, comparisons of past and current transactional activity are made and a change in account usage is determined. In the systems and methods, account data associated with one or more account are received and the account data is stored in a storage device; a first trigger group comprising one or more transactions occurring during a first period of time and a second trigger group comprising one or more transactions occurring during a second period of time are identified based on the account data; the first trigger group and the second trigger group are compared; and a decrease in account activity for each of the one or more accounts is determined in response to the comparison of the first trigger group and second trigger group.

Abstract: Systems and methods for producing and maintaining account related triggers are provided herein. The systems and methods develop effective communication routines to aid in trigger delivery. In the systems and methods, account data associated with one or more account are received and the account data is stored in a storage device; patterns of account activity are determined based on the account activity; parameters associated with the patterns of activity are identified; and triggers are formed based on the pattern of account activity and parameters.

Abstract: Systems and methods for producing and maintaining account related triggers are provided herein. The systems and methods may be utilized for monitoring of one or more accounts of a financial institution. Triggers may be executed to monitor financial account ratios. Offers may be triggered based on the account ratios or changes in the account ratios.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.

Abstract: An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a high removal rate on barrier material and a low removal rate on copper and dielectric material. The first slurry comprises at least an organic polymeric abrasive.

Abstract: An abrasive free formulation for chemical mechanical polishing and method for using the formulation for polishing copper and related materials. The abrasive free formulation has a high removal rate on copper and a low removal rate on barrier material. The abrasive free formulation comprises at least an oxidizing agent and an activating agent.

Abstract: A fully associative cache memory has a finite state machine which creates and maintains a linked list structure within the cache. This linked list structure allows the fully associative cache memory to be implemented in a structure other than a complex FIFO arrangement, as is typically required by systems of the prior art.

Abstract: A digital computer system including a memory subsystem thereof for increasing the throughput of the digital computer system is disclosed, comprising a central processing unit (CPU), a main memory, and a Look-ahead Instruction Prefetch Buffer (LIPB) external to the CPU for prefetching at least one portion of instruction code from the main memory each time the CPU initiates a request for instruction code from the main memory and for accelerating the submission of the portion of instruction code to said CPU means upon request by said CPU means without a memory system delay that is usually required when accessing a larger number of memory locations in the main memory each time the CPU initiates an instruction code request.