Patents by Inventor Deepal U. Wehella-Gamage

Deepal U. Wehella-Gamage has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring structure for trench fuse component with methods of fabrication
    Patent number: 9431339
    Abstract: The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped conductive layer being positioned between two insulator layers of an integrated circuit (IC) structure; a dielectric liner positioned between the first electrical terminal and the doped conductive layer; a second electrical terminal embedded within the doped conductive layer; wherein each of the first electrical terminal and the second electrical terminal are further embedded in one of the two insulator layers, and the dielectric liner is configured to degrade upon becoming electrically charged.
    Type: Grant
    Filed: February 19, 2014
    Date of Patent: August 30, 2016
    Assignee: International Business Machines Corporation
    Inventors: Toshiaki Kirihata, Edward P. Maciejewski, Subramanian S. Iyer, Chengwen Pei, Deepal U. Wehella-Gamage
  • Wiring structure for trench fuse component with methods of fabrication
    Patent number: 9431340
    Abstract: The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped conductive layer being positioned between two insulator layers of an integrated circuit (IC) structure; a dielectric liner positioned between the first electrical terminal and the doped conductive layer; a second electrical terminal embedded within the doped conductive layer; wherein each of the first electrical terminal and the second electrical terminal are further embedded in one of the two insulator layers, and the dielectric liner is configured to degrade upon becoming electrically charged.
    Type: Grant
    Filed: October 6, 2015
    Date of Patent: August 30, 2016
    Assignee: International Business Machines Corporation
    Inventors: Toshiaki Kirihata, Edward P. Maciejewski, Subramanian S. Iyer, Chengwen Pei, Deepal U. Wehella-Gamage
  • WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION
    Publication number: 20160163642
    Abstract: The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped conductive layer being positioned between two insulator layers of an integrated circuit (IC) structure; a dielectric liner positioned between the first electrical terminal and the doped conductive layer; a second electrical terminal embedded within the doped conductive layer; wherein each of the first electrical terminal and the second electrical terminal are further embedded in one of the two insulator layers, and the dielectric liner is configured to degrade upon becoming electrically charged.
    Type: Application
    Filed: October 6, 2015
    Publication date: June 9, 2016
    Inventors: Toshiaki Kirihata, Edward P. Maciejewski, Subramanian S. Iyer, Chengwen Pei, Deepal U. Wehella-Gamage
  • WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION
    Publication number: 20150235945
    Abstract: The present disclosure generally relates to a wiring structure for a fuse component and corresponding methods of fabrication. A wiring structure for a fuse component according to the present disclosure can include: a first electrical terminal embedded within a doped conductive layer, the doped conductive layer being positioned between two insulator layers of an integrated circuit (IC) structure; a dielectric liner positioned between the first electrical terminal and the doped conductive layer; a second electrical terminal embedded within the doped conductive layer; wherein each of the first electrical terminal and the second electrical terminal are further embedded in one of the two insulator layers, and the dielectric liner is configured to degrade upon becoming electrically charged.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 20, 2015
    Applicant: International Business Machines Corporation
    Inventors: Toshiaki Kirihata, Edward P. Maciejewski, Subramanian S. Iyer, Chengwen Pei, Deepal U. Wehella-Gamage