Abstract: An apparatus and/or method discloses an automatic call-to-conference elevation (“ACE”) capable of facilitating a transition from a phone call to a video conference. An ACE process, in one embodiment, is able to activate an ACE application to elevate user devices from participating in an audio call to a video conference based on a conference selection selected by a meeting initiator, host, or attendee. After identifying the capabilities, attributes, and/or functionalities associated with the user devices in accordance with activation of ACE, a communication network coupling the user devices as meeting attendees is established for facilitating the video conference based on identified capabilities, attributes, and/or functionalities of the user devices. In one aspect, the process is capable of transitioning connections of the user devices from an audio call to a video conference.

Abstract: An apparatus and/or method discloses an automatic call-to-conference elevation (“ACE”) capable of facilitating a transition from a phone call to a video conference. An ACE process, in one embodiment, is able to activate an ACE application to elevate user devices from participating in an audio call to a video conference based on a conference selection selected by a meeting initiator, host, or attendee. After identifying the capabilities, attributes, and/or functionalities associated with the user devices in accordance with activation of ACE, a communication network coupling the user devices as meeting attendees is established for facilitating the video conference based on identified capabilities, attributes, and/or functionalities of the user devices. In one aspect, the process is capable of transitioning connections of the user devices from an audio call to a video conference.

Abstract: An apparatus and/or method discloses an automatic call-to-conference elevation (“ACE”) capable of facilitating a transition from a phone call to a video conference. An ACE process, in one embodiment, is able to activate an ACE application to elevate user devices from participating in an audio call to a video conference based on a conference selection selected by a meeting initiator, host, or attendee. After identifying the capabilities, attributes, and/or functionalities associated with the user devices in accordance with activation of ACE, a communication network coupling the user devices as meeting attendees is established for facilitating the video conference based on identified capabilities, attributes, and/or functionalities of the user devices. In one aspect, the process is capable of transitioning connections of the user devices from an audio call to a video conference.

Abstract: In one embodiment, the methods and apparatuses include: selectively sharing desktop content with an attendee device wherein the desktop content includes a shared window and a sliding type of window; displaying the desktop content including the sliding type of window on the presenter device; detecting a modification to the desktop content that is beneath the sliding type of window wherein the modification is performed by the attendee device; and excluding the sliding type of window from the desktop content for display on the attendee device.

Abstract: In one embodiment, an online collaborative computing session is initiated between a presenter device and a plurality of attendee devices via a server in a computer network. The server distributes session data from the presenter device to the plurality of attendee devices. To decrease the amount of traffic in the network, at least one of the plurality of attendee devices may be selected as a super node, where each super node is then responsible for one or more corresponding attendee devices of the session. The session data is received at the super nodes and distributed from the super node to its one or more corresponding attendee devices.

Abstract: A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.

Abstract: A surface treatment method for solder joint employs alkali buffer solution dipping the solder joint and the alkali buffer solution reacts with the solder joint thus yielding a passive layer. As the resultant passive layer forms on the surface of the solder joint, thereby prevents further corrosion and dissolution during aqueous cleaning or water dipping thereafter. In addition, the passive layer ensures a good appearance with maximum protection of the solder joint and also provides a sound reliability and a high testability of a finished electronic product equipped with the solder joint.