Patents by Inventor Deheng LI

Deheng LI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12207595
    Abstract: A multifunctional controllable multi-layer co-extruded biodegradable mulching film and a preparation method thereof. The multifunctional controllable multi-layer co-extruded biodegradable mulching film sequentially includes a skeleton layer, a functional layer and a controlled release layer from top to bottom; the skeleton layer, functional layer and controlled release layer are all based on PBAT and PLA (polylactic acid) resin; the raw materials of the skeleton layer also include reinforcing and toughening master batches; the raw materials of the functional layer also include functional master batches; the raw materials of the controlled release layer also include starch-based derivatives. The mulching film is prepared by multi-layer co-extrusion technology.
    Type: Grant
    Filed: July 3, 2024
    Date of Patent: January 28, 2025
    Assignee: Shandong Agricultural University
    Inventors: Tangyuan Ning, Zhen Liu, Geng Li, Renzheng Zhang, Zihan Gai, Rou Chen, Deheng Zhang, Zihua Zhou, Qinglin Zhang
  • Patent number: 11490505
    Abstract: A method for reducing influence of a remote reference power noise on signal quality is provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: November 1, 2022
    Assignee: INSPUR SUZHOU INTELLIGENT TECHNOLOGY CO., LTD.
    Inventors: Deheng Li, Fazhi Liu, Minzheng Tian, Ning Wu
  • Publication number: 20220151057
    Abstract: A method and system for reducing influence of a remote reference power noise on signal quality are provided. A remote reference power plane connected to a power module is identified according to a schematic diagram of signal design, and a noised power plane is determined. A position of the noised power plane is found in a PCB, and whether the noised power plane is remote referenced by a high-speed signal is judged. Placement positions and number of connection capacitors are determined according to a layout and routing position of the high-speed signal and a width of the noised power plane. Two capacitors with fixed capacitance values are placed at the placement positions of the connection capacitors. Connection capacitors are added to a position of a noised remote reference power plane of a signal line for connecting the power plane and the ground.
    Type: Application
    Filed: November 27, 2019
    Publication date: May 12, 2022
    Inventors: Deheng LI, Fazhi LIU, Minzheng TIAN, Ning WU
  • Patent number: 11137811
    Abstract: A power supply system for reducing voltage fluctuation of a rack GPU, which includes: a PSU power supply module, two power supply copper plates including a first power supply copper plate and a second power supply copper plate, two transfer copper plates including a first transfer copper plate and a second transfer copper plate, and two crown clips including a first crown clip and a second crown clip. The PSU power supply module is connected to the first power supply copper plate, the first power supply copper plate is connected to a BUS BAR through the first transfer copper plate and the first crown clip sequentially, the BUS BAR is connected to the second power supply copper plate through the second crown clip and the second transfer copper plate sequentially, and the second power supply copper plate is connected to a GPU module mainboard.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: October 5, 2021
    Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventor: Deheng Li
  • Publication number: 20210223845
    Abstract: A power supply system for reducing voltage fluctuation of a rack GPU, which includes: a PSU power supply module, two power supply copper plates including a first power supply copper plate and a second power supply copper plate, two transfer copper plates including a first transfer copper plate and a second transfer copper plate, and two crown clips including a first crown clip and a second crown clip. The PSU power supply module is connected to the first power supply copper plate, the first power supply copper plate is connected to a BUS BAR through the first transfer copper plate and the first crown clip sequentially, the BUS BAR is connected to the second power supply copper plate through the second crown clip and the second transfer copper plate sequentially, and the second power supply copper plate is connected to a GPU module mainboard.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 22, 2021
    Applicant: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventor: Deheng LI
  • Patent number: 10869386
    Abstract: Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: December 15, 2020
    Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventor: Deheng Li
  • Publication number: 20200137880
    Abstract: Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.
    Type: Application
    Filed: June 13, 2018
    Publication date: April 30, 2020
    Applicant: Zhengzhou Yunhai Information Technology Co., Ltd.
    Inventor: Deheng LI