Patents by Inventor Deivasigamani MOULEESWARAN

Deivasigamani MOULEESWARAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for processing a semiconductor device
    Patent number: 11227779
    Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: January 18, 2022
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Jiapei Ding, Kar Weng Yan, Teng Hock Kuah, Jian Liao, Keng Yew Song, Bin Yuan, Deivasigamani Mouleeswaran
  • APPARATUS AND METHOD FOR PROCESSING A SEMICONDUCTOR DEVICE
    Publication number: 20190080939
    Abstract: The invention provides an apparatus, for processing a semiconductor device, comprising a first tool which comprises a pressure application component, a guide, and a spacer moveable in the guide. A gap is defined between the spacer and the guide and is operable to allow the spacer to tilt in relation to the guide. The apparatus also comprises a second tool for holding the semiconductor device, wherein the first and second tools are moveable relative to each other between an uncoupled state and a coupled state. The spacer comprises a first portion proximate the pressure application component, wherein in the coupled state, the pressure application component is operable to apply a force as a first pressure to the first portion.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 14, 2019
    Inventors: Jiapei DING, Kar Weng YAN, Teng Hock KUAH, Jian LIAO, Keng Yew SONG, Bin YUAN, Deivasigamani MOULEESWARAN