Patents by Inventor Dejia WEI

Dejia WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250037770
    Abstract: A memory device includes a memory string, and a control logic coupled to the memory string. The control logic is configured to perform a first programming operation and a second programming operation on a selected memory cell of the memory string, after the first programming operation and before the second programming operation, apply a ground voltage to a first word line coupled to the selected memory cell, and apply a first voltage to a second word line coupled to an unselected memory cell of the memory string, wherein the first voltage is higher than the ground voltage.
    Type: Application
    Filed: October 11, 2024
    Publication date: January 30, 2025
    Applicant: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
    Inventors: Hongtao Liu, Ying Huang, Wenzhe Wei, Song Min Jiang, Dejia Huang, Wen Qiang Chen
  • Publication number: 20240306799
    Abstract: Disclosed packsack damping module and packsack, comprises a housing, a first movable member, a second movable member and an elastic element, the housing is internally provided with a mounting cavity; the first movable member and the second movable member are both provided in the mounting cavity; the first movable member is connected with one end of the elastic element, the other end of the elastic element is connected with the second movable member; or the elastic element is provided with the first elastic member and the second elastic member, one end of the first elastic member is connected with the first movable member, the other end of the first elastic member is connected with the housing, one end of the second elastic member is connected with the first movable member, the other end of the second elastic member is connected with the housing. The disclosure improves the damping effect.
    Type: Application
    Filed: May 24, 2024
    Publication date: September 19, 2024
    Inventors: Shutao WEI, Dejia WEI, Qingjing ZHOU, Pengju FU