Abstract: A printed circuit board having a built-in antenna may include a first unit substrate, in which a ground and a first radiator are formed; a second unit substrate, which is stacked over the first unit substrate, and in which a second radiator having a frequency band different from a frequency band of the first radiator is formed; a pair of striplines, formed in the first unit substrate and connected with the ground; a first via, which connects the first radiator with the second radiator; a pair of second vias, each of which has one end connected with the pair of strip lines respectively; and a connection pattern, which connects the other ends of the pair of second vias to each other. The printed circuit board having a built-in antenna can utilize multiple frequency bands, and can be implemented in a compact size, to be applicable in compact communication devices.

Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Abstract: An electro-magnetic bandgap structure is disclosed. The electro-magnetic bandgap structure in accordance with an embodiment of the present invention includes a plurality of conductive plates bridge-connected with one another on a same plane, whereas the each of the conductive plates includes an internal patch; a first ring patch be electrically separated from the internal patch and surrounding the internal patch; and a second ring patch surrounding the first ring patch and electrically connected with the first ring patch through a portion.

Abstract: A method of manufacturing a printed circuit board including: forming a heat dissipating coating layer on the surface of a heat dissipating layer; forming circuit patterns on the surface of an insulating layer, and forming an inter-layer conductive part joining with the insulating layer by passing through the insulating layer and electrically connected with the circuit patterns; and laminating the insulating layer on the heat dissipating layer such that the inter-layer conductive part is connected with the heat dissipating coating layer.

Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: An electro-magnetic bandgap structure is disclosed. The electro-magnetic bandgap structure in accordance with an embodiment of the present invention includes a plurality of conductive plates bridge-connected with one another on a same plane, whereas the each of the conductive plates includes an internal patch; a first ring patch be electrically separated from the internal patch and surrounding the internal patch; and a second ring patch surrounding the first ring patch and electrically connected with the first ring patch through a portion.

Abstract: The present invention provides a composition for surface modification of a heat sink, the composition including: 0.01 to 10 parts by weight of an organic titanium compound; 0.01 to 5 parts by weight of an organic silane compound; 0.1 to 10 parts by weight of an organic acid; 0.01 to 5 parts by weight of a sequestering agent; and 0.1 to 10 parts by weight of a buffer with respect to 100 parts by weight of distilled water. The composition of the present invention provides excellent adhesion strength with prepreg, and improve heat releasing performance.

Abstract: A printed circuit board having a built-in antenna may include a first unit substrate, in which a ground and a first radiator are formed; a second unit substrate, which is stacked over the first unit substrate, and in which a second radiator having a frequency band different from a frequency band of the first radiator is formed; a pair of striplines, formed in the first unit substrate and connected with the ground; a first via, which connects the first radiator with the second radiator; a pair of second vias, each of which has one end connected with the pair of strip lines respectively; and a connection pattern, which connects the other ends of the pair of second vias to each other. The printed circuit board having a built-in antenna can utilize multiple frequency bands, and can be implemented in a compact size, to be applicable in compact communication devices.

Abstract: A printed circuit board and a manufacturing method of the same. The method includes forming a circuit board by selectively positioning a heat release layer among multiple insulation layers that have circuit patterns formed on their surfaces, perforating a through-hole that penetrates through one side and the other side of the circuit board, forming a metal film over the heat release layer exposed at an inner wall surface of the through-hole, and forming a plating layer by depositing a conductive metal over an inner wall of the through-hole. By having the heat release layer selectively inserted inside the circuit board, the heat releasing effect may be improved, and the bending strength may be increased. Moreover, a reliable electrical connection can be implemented between the heat release layer and the circuit pattern, making it possible to utilize the heat release layer as a power supply layer or a ground layer.

Abstract: A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.

Abstract: A printed circuit board and a method of manufacturing thereof are disclosed. With a printed circuit board comprising an insulating layer; a circuit pattern formed on one side of the insulating layer; an inter-layer conductive part joining with the insulating layer by passing through the insulating layer, and electrically connected to the circuit pattern; a heat dissipating layer laminated on the other side of the insulating layer; and a heat dissipating coating layer interposed between the insulating layer and the heat dissipating layer, and connected with the inter-layer conductive part, the heat contained in the insulating layer may be delivered to the heat dissipating layer effectively and the efficiency of heat dissipation may be improved.

Abstract: A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method includes pre-routing a portion of an adhesive meeting the optical waveguide to remove the portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract: Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Abstract: Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Abstract: Disclosed is a PCB in which a waveguide is embedded, and a method of producing the same. The PCB includes a substrate, and a lower clad layer formed on the substrate through a predetermined process to allow an optical signal irradiated thereto to be total-reflected thereby. A core layer is formed on the lower clad layer through a predetermined process and exposed using an exposing film on which a waveguide pattern is formed to form the waveguide with a predetermined shape therefrom. Furthermore, an upper clad layer is formed on the core layer through a predetermined process to allow the optical signal irradiated thereto to be total-reflected thereby.

Abstract: Disclosed is an optical printed circuit board (PCB) for long-distance signal transmission, which is combined with fiber blocks and pipe blocks embedded in opto-via holes to form a multi-layered optical PCB, and transmits an optical signal using a fiber ribbon when an optical signal transmission distance between layers constituting the multi-layered optical PCB is longer than a length of an optical waveguide element used in conjunction with a silicon substrate. The optical PCB comprises a base substrate including an insulating material, a copper foil, and an opto-via hole, and an optical signal transmission member attached to the base substrate to horizontally transmit an optical signal. An optical signal connection member is horizontally connected to the optical signal transmission member to transmit the optical signal across a desired distance.

Abstract: Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlayer delamination, thereby providing a highly reliable rigid-flexible PCB which thus meets the recent requirements of electric appliances for low energy consumption, high frequency adoption, and slimness.