Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: This method for producing a non-plane comprises fitting a flexible component onto a carrier by means of hybridization columns, each column having a first height and including a volume of solder material formed between two surfaces wettable by said solder material added to the flexible component and to the carrier respectively, said wettable surfaces being surrounded by zones non-wettable by the solder material, the wettable surfaces and the volume of solder material being determined as a function of a second height required for the flexible component relative to the carrier at the place where the column is formed, such that the column varies from the first height to the second height when the volume of material is brought to a temperature higher than or equal to its melting point and heating the volumes of solder material of the columns to a temperature higher than or equal to the melting point of said material in order to melt it.

Abstract: The invention relates to a method for producing a curved circuit. According to the invention, this method involves forming, in one face of said circuit and in at least one predetermined direction, cuts having a triangular cross-section which are parallel to each other and extend to either side of said circuit; depositing adhesive on the flanks of the cuts thus made; and moving the flanks of the cuts together so as to close them.