Patents by Inventor Delphine Mathey

Delphine Mathey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Perforated electronic package and method of fabrication
    Patent number: 9196590
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Grant
    Filed: March 6, 2015
    Date of Patent: November 24, 2015
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac
  • PERFORATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
    Publication number: 20150262941
    Abstract: An electronic package includes an integrated circuit chip mounted to a support plate and encapsulated by an encapsulating body. The package includes at least one weakening deep perforation. The perforation is formed in either the support plate or the encapsulating body, and functions to reduce a resistance of the package to bending stresses perpendicular to the support plate.
    Type: Application
    Filed: March 6, 2015
    Publication date: September 17, 2015
    Applicants: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics (Rousset) SAS
    Inventors: Francis Steffen, Delphine Mathey, Gilbert Assaud, Rémi Brechignac