Abstract: A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Abstract: A sensor for sensing a gap between the sensor and an object of interest within a semiconductor processing chamber is provided. The sensor includes a housing, a power source inside the housing, wireless communication circuitry, a controller, measurement circuitry and a plurality of capacitive plate pairs. The controller and wireless communication circuitry are coupled to each other, and to the power source. The plurality of capacitive plate pairs are configured to form capacitors having a capacitance that varies with the gap. Measurement circuitry is coupled to the controller and to the plurality of capacitive plate pairs. The measurement circuitry is configured to measure the capacitance of the capacitive plate pairs and provide indications thereof to the controller. The controller is configured to provide an indication relative to the gap based, at least in part, upon the measured capacitances.

Abstract: A wireless sensor includes at least one capacitive plate for sensing a distance relative to an object of interest within a semiconductor-processing environment. The sensor includes an internal power source and wireless communication such that distance and/or parallelism measurements effected using the capacitive plate(s) can be provided wirelessly to an external device.

Abstract: A method of sensing proximity to a showerhead in a semiconductor-processing system is provided. The method includes measuring a parameter that varies with proximity to the showerhead, as well as with at least one external factor. The method also includes measuring a parameter that does not vary with proximity to the showerhead, but does vary with the at least one factor. A compensated proximity output is calculated based upon the measured parameters and is provided as an output.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: A system for determining a distance between a showerhead of a semiconductor processing system and a substrate-supporting pedestal is provided. The system includes a showerhead having a showerhead surface from which reactive gas is expelled and a pedestal having a pedestal surface that faces the showerhead surface. A first capacitive plate is disposed on the pedestal surface. A second capacitive plate is disposed on the showerhead surface. A third capacitive plate disposed on one of the showerhead surface and the pedestal surface, but spaced from the first and second capacitive plates. Capacitance measurement circuitry is operably coupled to the first, second and third capacitive plates.

Abstract: A substrate-like particle sensor includes a substrate-like base portion and an electronics enclosure disposed on the substrate-like base portion. A power source is located within the electronics enclosure. A controller is operably coupled to the power source. A particle sensor is operably coupled to the controller and provides an indication to the controller of at least one particle present near the particle sensor.

Abstract: A sensor for sensing a gap between the sensor and an object of interest within a semiconductor processing chamber is provided. The sensor includes a housing, a power source inside the housing, wireless communication circuitry, a controller, measurement circuitry and a plurality of capacitive plate pairs. The controller and wireless communication circuitry are coupled to each other, and to the power source. The plurality of capacitive plate pairs are configured to form capacitors having a capacitance that varies with the gap. Measurement circuitry is coupled to the controller and to the plurality of capacitive plate pairs. The measurement circuitry is configured to measure the capacitance of the capacitive plate pairs and provide indications thereof to the controller. The controller is configured to provide an indication relative to the gap based, at least in part, upon the measured capacitances.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

Abstract: A system for remultiplexing packets that are provided at variable rates in digital bitstreams using a delay buffer and rate estimation. A bitstream with specific packet types provided at different rates is extracted from a multiplex and combined with other fixed or variable rate bit streams in such a way that timing delivery constraints on the extracted variable rate bitstream are followed. The extracted bitstream is smoothed to reduce variations in the data rate. The smoothed bitstream is then processed in first and second parallel paths. In the first path, selected packets are discarded to obtain a retained data stream. The data rate of the retained data stream is estimated and provided to a control. In the second path, the smoothed bitstream is delayed according to at least the processing time of the rate estimator in the first path, then the selected packets are discarded to obtain a delayed, retained data stream.