Abstract: An apparatus includes a housing, a component cradle, and a plurality of towers. The housing generally has an inner mounting surface. The component cradle may be formed on the inner mounting surface of the housing. The plurality of towers may be formed on and extending from the inner mounting surface of the housing around the component cradle. The towers are generally deformable into a form-fitting engagement with an electronic component placed on the component cradle.

Abstract: An apparatus comprises a housing, a component cradle, and a plurality of towers. The housing generally has an inner mounting surface. The component cradle may be formed on the inner mounting surface of the housing. The plurality of towers may be formed on and extending from the inner mounting surface of the housing around the component cradle. The towers are generally deformable into a form-fitting engagement with an electronic component placed on the component cradle.

Abstract: An apparatus includes a housing, a circuit board, a sealant and a baseplate. The housing may have a shelf and a flange along an open side. The circuit board may be (i) disposed on the shelf of the housing and inside the flange of the housing and (ii) secured to the housing. The sealant may be dispensed (i) through the open side of the housing and (ii) along a gap between the flange and the circuit board. The baseplate may be compressed to the housing thereby causing the sealant to flow between (i) the baseplate and the circuit board and (ii) the baseplate and the flange.

Abstract: An apparatus includes a housing, a circuit board, a sealant and a baseplate. The housing may have a shelf and a flange along an open side. The circuit board may be (i) disposed on the shelf of the housing and inside the flange of the housing and (ii) secured to the housing. The sealant may be dispensed (i) through the open side of the housing and (ii) along a gap between the flange and the circuit board. The baseplate may be compressed to the housing thereby causing the sealant to flow between (i) the baseplate and the circuit board and (ii) the baseplate and the flange.

Abstract: A compression resistant component adapted to be mounted to a surface using a mechanical fastener having a component body with a first surface and a second surface and a fastener passage defined by the component body extending from the first surface to the second surface. At least one elongated compression limiter is embedded in the component body displaced from and substantially parallel to a main longitudinal axis of the fastener passage. The elongated compression limiter if formed of a material having a greater compressive modulus that the material of which the component body is formed. When a fastener exerts a compressive force on the mounting component, the elongated compression limiter bears a portion of the compressive force exerted by the fastener on the component body, thereby allowing the component body to resist the effects of the compressive force.

Abstract: A compression resistant component adapted to be mounted to a surface using a mechanical fastener having a component body with a first surface and a second surface and a fastener passage defined by the component body extending from the first surface to the second surface. At least one elongated compression limiter is embedded in the component body displaced from and substantially parallel to a main longitudinal axis of the fastener passage. The elongated compression limiter if formed of a material having a greater compressive modulus that the material of which the component body is formed. When a fastener exerts a compressive force on the mounting component, the elongated compression limiter bears a portion of the compressive force exerted by the fastener on the component body, thereby allowing the component body to resist the effects of the compressive force.

Abstract: A circuit assembly 10 for holding an electronic component 26 relative to a circuit board 16 comprises a housing 12 coupled to the circuit board 16. A separable cradle 24 is coupled to the housing 12 and is sized to receive the electronic component 26. The cradle 24 has a support post 28 for spacing the cradle 25 a predetermined distance from the circuit board 16. In a further aspect of the invention, the housing 12 may be a module housing or a connector 14. The cradle 24 may be separable from the housing, Leads (26) pass through the cradle holes 46 and housing holes 44 to be soldered to the circuit board.