Patents by Inventor Demick Boyden

Demick Boyden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230328913
    Abstract: A field-replaceable unit (FRU) includes a self-actuating protective cover device that includes: a protective cover, a housing component that includes a slot, a driving link component attached to the protective cover and the housing component, a supporting link component attached to the protective cover and the housing component, and an engagement component attached to the driving link component, wherein the engagement component is to move within the slot of the housing component, and the engagement component is to cause the driving link component, the supporting link component, and the protective cover to move when the engagement component moves within the slot of the housing component. The protective cover is to be positioned over one or more connectors of the FRU when the engagement component is positioned at an unengaged position within the slot of the housing component.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Inventors: Jimmy Chun-Chuen LEUNG, Franklin Demick BOYDEN, Sean KIM
  • Publication number: 20230266807
    Abstract: A power supply assembly includes an input module that includes one or more captive screws, one or more first power supply connection components, and one or more first input feed connection components; and a power supply unit that includes one or more captive screw connection switches, one or more second power supply connection components, and one or more second input feed connection components. The input module is to physically and electrically connect to the power supply unit; the one or more captive screws are to physically engage, respectively, the one or more captive screw connection switches; the one or more first power supply connection components are to physically and electrically connect to, respectively, the one or more second power supply connection components; and the one or more first input feed connection components are to physically and electrically connect to, respectively, the one or more second input feed connection components.
    Type: Application
    Filed: February 18, 2022
    Publication date: August 24, 2023
    Inventors: Varaha Venkata Satya Narayana JAGARAPU, Muhammad SAGARWALA, Katsuhiro OKAMURA, Franklin Demick BOYDEN, Jaspal S. GILL, David K. OWEN
  • Patent number: 8503851
    Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 6, 2013
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, David J. Lima
  • Patent number: 8233762
    Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: July 31, 2012
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, David J. Lima
  • Patent number: 7885066
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: February 8, 2011
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker
  • Publication number: 20100014248
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Applicant: JUNIPER NETWORKS, INC.
    Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker
  • Patent number: 6629855
    Abstract: A memory system is disclosed that includes memory modules that are longer and taller than conventional prior art memory modules. Each memory module includes two roughly L-shaped openings that extend from the top surface of the memory module near each side surface of the memory module. These L-shaped openings form tabs that extend horizontally along the top surface of the memory module. A guide assembly that includes sockets and guides is adapted to receive the memory module. Rotating latches that couple to each guide near the top of each guide engage a notch on each side surface of the memory module for facilitating insertion and removal. Rotation of each latch into a latched position engages a tab on the memory module so as to securely latch the memory module in place.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: October 7, 2003
    Assignee: Silicon Graphics, Inc.
    Inventors: David C. North, F. Demick Boyden
  • Patent number: 6428352
    Abstract: A circuit board support operable with boards requiring a horizontal motion for engagement of connectors. The support can be exchanged for a traditional standoff and screw combination without modification of the board or supporting structure.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: August 6, 2002
    Assignee: Silicon Graphics, Inc.
    Inventor: Franklin Demick Boyden