Patents by Inventor Demick Boyden

Demick Boyden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cable management system
    Patent number: 8503851
    Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.
    Type: Grant
    Filed: June 29, 2012
    Date of Patent: August 6, 2013
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, David J. Lima
  • Cable management system
    Patent number: 8233762
    Abstract: A system manages cables to connect to a device provided in a device chassis. The system includes a cable management boom connected to a top portion of the device chassis, cable management shelves connected to a side portion of the device chassis, and a cable management arm connected to and supported by the cable management shelves. The cable management arm is to retain the cables, pivot through an angle to provide access to the device provided in the device chassis, and route the cables from the device to the cable management boom. The cable management boom is to gather the cables, retain the cables, and route the cables above the device chassis.
    Type: Grant
    Filed: September 18, 2009
    Date of Patent: July 31, 2012
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, David J. Lima
  • Airflow/cooling solution for chassis with orthogonal boards
    Patent number: 7885066
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: February 8, 2011
    Assignee: Juniper Networks, Inc.
    Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker
  • AIRFLOW/COOLING SOLUTION FOR CHASSIS WITH ORTHOGONAL BOARDS
    Publication number: 20100014248
    Abstract: A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exits from the back of the apparatus. A horizontal set of modules is cooled with air flow that passes through openings in a midplane connecting the two sets of modules.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Applicant: JUNIPER NETWORKS, INC.
    Inventors: Demick Boyden, Pradeep Sindhu, Keith J. Hocker