Abstract: A display device provided with an MEMS light valve, comprising: a substrate, a fixed optical grating located on the substrate, an MEMS light valve for controlling the opening and closing of the fixed optical grating, the MEMS light valve comprises a first light valve and a second light valve; the opening and closing of the fixed optical grating is controlled via controlling the movement of the first light valve and the second light valve, and the moving directions of the first light valve and the second light valve are opposite. Also disclosed is a method for forming a display device provided with an MEMS light valve. Thus the sensitivity of the MEMS light valve is improved.

Abstract: The present invention relates to a pressure sensor, which may include a first electrode plate, a second electrode plate, a third electrode plate, a fourth electrode plate and a fifth electrode plate, which are successively laminated on a substrate, wherein the first electrode plate, the third electrode plate and the fourth electrode plate are fixed to the substrate, the first electrode plate and the second electrode plate are disposed opposite to each other and have a gap formed therebetween, the second electrode plate is suspended over the first electrode plate to constitute a first capacitor; the second electrode plate and the third electrode plate are disposed opposite to each other and have a gap formed therebetween, to constitute a second capacitor; and the fifth electrode plate is suspended over the fourth electrode plate to constitute a third capacitor, and can move along a direction perpendicular to the substrate.

Abstract: A low temperature wafer bonding method and a bonded structure are provided. The method includes: providing a first substrate having a plurality of metal pads and a first dielectric layer close to the metal pads, where the metal pads and the first dielectric layer are on a top surface of the first substrate; providing a second substrate having a plurality of semiconductor pads and a second dielectric layer close to the semiconductor pads, where the semiconductor pads and the second dielectric layer are on a top surface of the second substrate; disposing at least one of the metal pads in direct contact with at least one of the semiconductor pads, and disposing the first dielectric layer in direct contact with the second dielectric layer; and bonding the metal pads with the semiconductor pads, and bonding the first dielectric layer with the second dielectric layer.

Abstract: A method for manufacturing a micro-electro-mechanical system (MEMS) device is provided. The method comprises: providing a semiconductor substrate, the semiconductor substrate having a metal interconnection structure (100) formed therein; forming a first sacrificial layer (201) on the surface of the semiconductor substrate, the material of the first sacrificial layer is amorphous carbon; etching the first sacrificial layer to form a first recess (301); covering and forming a first dielectric layer (401) on the surface of the first sacrificial layer; thinning the first dielectric layer by a chemical mechanical polishing (CMP) process, until exposing the first sacrificial layer; forming a micromechanical structure layer (500) on the surface of the first sacrificial layer and exposing the first sacrificial layer, wherein a part of the micromechanical structure layer is connected to the first dielectric layer.

Abstract: A method for processing a thin film micro device on a substrate includes: 1) depositing a carbon film on the substrate as a sacrificial layer; 2) photolithographically defining a first predetermined pattern in the carbon film; 3) etching an unwanted portion of the carbon film outside the first predetermined pattern; 4) depositing a structural film including a single or multiple layers of solid state materials; 5) photolithographically defining a second predetermined pattern in the structural film; 6) etching the discarded portion of the structural film outside the second predetermined pattern; 7) selectively removing the remaining portion of the sacrificial carbon film by using a selective etch process gas in a reactor chamber, so that the overlapped portion of the remaining structural element with the first predetermined pattern is suspended above an underneath cavity above the substrate.

Abstract: A light modulator pixel unit and the manufacturing method thereof are provided. The pixel unit includes a top electrode formed on a substrate, a movable electrode and a bottom electrode. Under the control of a control circuit, the position of the movable electrode would deflect. When the movable electrode is positioned in a first position, a first light is diffracted on the top electrode; when the movable electrode is positioned in a second position, a second light is diffracted on the top electrode; when the movable electrode is positioned in a third position, a third light is diffracted on the top electrode. The said first light, second light and third light are lights of three primary colors. The light modulator pixel unit of the present invention can modulate lights of three colors and is applicable in the field of micro-display system.

Abstract: An inertia MEMS sensor and a manufacturing method are provided. The inertia MEMS sensor includes a main body and a weight block relatively removable. The main body includes a first main body with a first surface and a second main body vertically connecting with the first surface. A first electrode parallel to the first surface is in the first main body. A second electrode perpendicular to the first surface is in the second main body. The weight block is suspended in a space defined by the first and second main bodies. The weight block includes a third electrode parallel to the first surface, a forth electrode is perpendicular to the first surface, and a weight layer. The third electrode connects with the forth electrode to form a U-shaped groove for accommodating the weight layer, thereby increasing the weight block weight, improving precision and reducing the cost.

Abstract: A micro-electro-mechanical microphone and manufacturing method thereof are provided in the invention. The micro-electro-mechanical microphone comprises: a diaphragm, which is formed on a surface of one side of a semiconductor substrate, exposed to the outside surroundings, and can vibrate freely by sensing the pressure generated by sound waves; an electrode plate with air holes, which is under the diaphragm; an isolation structure for fixing the diaphragm and the electrode plate; an air gap cavity between the diaphragm and the electrode plate, and a back cavity under the electrode plate and in the semiconductor substrate; a second cavity formed on the surface of the same side of the semiconductor substrate and in an open manner; the air gap cavity is connected with the back cavity through the air holes of the electrode plate; the back cavity is connected with the second cavity through an air groove formed in the semiconductor substrate.

Abstract: A Micro-Electro-Mechanical System (MEMS) device and its manufacturing method are provided. Said device comprises a MEMS component and said component comprises a main body (10) and a movable electrode (20). Said main body (10) contains a fixed electrode (110) and a cavity (30) and is covered by a first dielectric layer (400) which seals said cavity (30) into an enclosure. Said movable electrode (20) is connected with said main body (10) flexibly by a fixing piece and overhangs in said enclosure. Vias (405) are formed in said first dielectric layer (400) and filled with a second dielectric layer (500). The patent enables effective packaging for a MEMS device.

Abstract: A gyroscope and a manufacturing method are provided. The gyroscope comprises: a substrate with a bottom driving electrode and a bottom measuring electrode, and a dielectric layer with a sealed cavity comprising: a central axis on the substrate; a support ring on the substrate rotatable around the central axis; a mass ring surrounding and having common central axis with the support ring; cantilevers connected with the support ring and the mass ring and suspend the mass ring in the cavity; elastic components among the support ring, the mass ring and two adjacent cantilevers; a top driving electrode overlaying the support ring, the mass ring, the cantilevers and the elastic components; a conductive plug connected with top driving electrode and bottom driving electrode on the elastic components. The mass ring comprises an insulation layer and a weight layer. Stability and performance of the gyroscope may be improved.

Abstract: A light modulator pixel unit and a method for manufacturing the same are provided. The light modulator pixel unit includes top, movable and bottom electrodes. Under control of a control circuit, the movable electrode may shift to first, second and third positions corresponding to modulations of first, second and third monochromatic lights, respectively. When the movable electrode is at a certain position, the incident light corresponding to the position may be divided into two parts, one is reflected by the top electrode, and the other one may bypass the top electrode and be reflected by the movable electrode. The two parts may interfere destructively. The light modulator pixel unit of the present invention can control monochromatic lights of three special wavelengths by time division, and enable color control and gray control. The unit is applicable in the field of projection display and panel system.

Abstract: A projection display device includes a first display panel (23a), a second display panel (23b), a PBS (Polarization Beam Splitter) (22) with a first surface (22a) and a second surface (22b) opposite each other, a light recycling device (25a, 25b and 23b), and a projection lens (24). The PBS (22) transmits a first type parallel polarized light and reflects a second type parallel polarized light. The light recycling device (25a, 25b and 23b) transforms the first type parallel polarized light transmitted by the PBS (22) into the second type parallel polarized light which carries a second image information, then reversely transmits the second type parallel polarized light to the second surface (22b) of the PBS (22).The projection display device improves the light utilization efficiency and can be used for 3D display.

Abstract: An integrated opto-electronic device, a portable reflective projection system and a method for in situ monitoring and adjusting light illumination are provided. The device includes a reflective polarizing composite film (150) configured to receive a source light (210) at a desired non-normal incident angle (221), polarizes and reflects a first portion (211) of said source light (210) as polarized illumination light (16) at a reciprocal angle (222) to said desired non-normal incident angle (221); and a photovoltaic cell (180), adhered to an opposite side of said reflective polarizing composite film (150) to said source light (210), configured to receive a second portion (212) of said source light (210) that passes through said reflective polarizing composite film (150) and transform said second portion (212) to photogenerated charge. Unused illumination can be collected in order to re-store and reuse recovered energy.

Abstract: An optical projection engine device uses a symmetrical wire grid polarizing beam splitter (PBS) that splits incident illumination to a symmetrical pair of polarized light beams in two orthogonal polarization states, one by reflection and the other by transmission, for illuminating a pair of reflective modulation imagers respectively. In identical geometric configuration, the two synchronized reflective modulation imagers polarization modulate polarized light beams as received, and reflect them back towards the PBS, which through transmission and reflection respectively, combines and projects two modulated light beams through a projection lens system to form a pair of spatially overlapped illumination images of aligned pixels with the same image in two orthogonal polarization states on a projection screen. The device jointly provides improvement optical efficiency and expanded function to three dimensional stereoscopic displays.

Abstract: A charge pump includes a first voltage input node, a second voltage input node, a voltage output node, at least a flying capacitor, an energy reserve capacitor, a first MEMS switches group controlled by a controlling signal, a second MEMS switches group controlled by the controlling signal, a third MEMS switches group controlled by the controlling signal and a forth MEMS switches group controlled by the controlling signal. The flying capacitor is connected with the first voltage input node and the second voltage input node via the first MEMS switches group. The flying capacitor is connected with the first voltage input node or the second voltage input node via the second MEMS switches group. The energy reserve capacitor is connected with the flying capacitor via the third MEMS switches group. The energy reserve capacitor is connected with the voltage output node and the second voltage input node.

Abstract: A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.

Abstract: A spatial optical modulation array device includes regularly packed micro optical-electrical-mechanical pixels in a planner configuration on a semiconductor substrate, each pixel electrically actuated independently and thus operated optically in the binary modes, reflection and diffraction to incident illumination. Subject to the electrostatic contraction or compulsion driven by a pixel circuitry, the top metal reflector is placed accurately at the minimum or maximum spacing from the static bottom metal reflector in an odd or even integral multiple of a quarter wavelength within visual light spectrum, so that diffraction or reflection in destructive or constructive interference is achieved respectively and thus incident illumination modulated independently in closely binary modes at each micro optical-electrical-mechanical pixel.

Abstract: An optical projection engine device uses a symmetrical wire grid polarizing beam splitter (PBS) that splits incident illumination to a symmetrical pair of polarized light beams in two orthogonal polarization states, one by reflection and the other by transmission, for illuminating a pair of reflective modulation imagers respectively. In identical geometric configuration, the two synchronized reflective modulation imagers polarization modulate polarized light beams as received, and reflect them back towards the PBS, which through transmission and reflection respectively, combines and projects two modulated light beams through a projection lens system to form a pair of spatially overlapped illumination images of aligned pixels with the same image in two orthogonal polarization states on a projection screen. The device jointly provides improvement optical efficiency and expanded function to three dimensional stereoscopic displays.

Abstract: A method of photolithographic patterning mainly includes: converting a first photolithographic pattern by a digital transformation in a first magnification to a second photolithographic pattern; producing a first optical reticle corresponding to the second photolithographic pattern by an initial lithography in a 1-to-1 image transfer; fabricating a second optical reticle on a transparent substrate by a first photolithography in a first demagnification corresponding to the first optical reticle; and fabricating a microscopic pattern of same dimension as the first photolithographic pattern on a wafer substrate by a second demagnification using the second optical reticle. The multiplication of the first magnification by the first demagnification by the second demagnification equals one. The present invention implements fine patterning on a wafer substrate so as to improve efficiency of photolithographic application.

Abstract: A method for processing a thin film micro device on a substrate includes: 1) depositing a carbon film on the substrate as a sacrificial layer; 2) photolithographically defining a first predetermined pattern in the carbon film; 3) etching an unwanted portion of the carbon film outside the first predetermined pattern; 4) depositing a structural film including a single or multiple layers of solid state materials; 5) photolithographically defining a second predetermined pattern in the structural film; 6) etching the discarded portion of the structural film outside the second predetermined pattern; 7) selectively removing the remaining portion of the sacrificial carbon film by using a selective etch process gas in a reactor chamber, so that the overlapped portion of the remaining structural element with the first predetermined pattern is suspended above an underneath cavity above the substrate.