Patents by Inventor Deng Gao

Deng Gao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BRUSH FOR CLEANING WAFERS AFTER CHEMICAL MECHANICAL POLISHING (CMP) PROCESS
    Publication number: 20240180324
    Abstract: Brushes for cleaning wafers after a Chemical Mechanical Polishing (CMP) process and methods for fabricating such brushes are provided. An exemplary method for fabricating a brush for cleaning wafers after a Chemical Mechanical Polishing (CMP) process includes forming a brush configured for contacting the wafers; and, while forming the brush, controlling formation of pores within the brush to a maximum pore dimension, wherein the maximum pore dimension is 1000 nanometers (nm).
    Type: Application
    Filed: February 13, 2023
    Publication date: June 6, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jhih-Fong Lin, Liqing Wen, Le Lu, Deng-Gao Chen
  • Cup
    Patent number: D972889
    Type: Grant
    Filed: December 27, 2021
    Date of Patent: December 20, 2022
    Assignee: SHENZHEN AI WEI YI TECHNOLOGY CO., LTD
    Inventor: Deng Gao