Abstract: This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.

Abstract: An instruction device is provided for communicating an instruction and an icon in an image area, and includes a motion sensing unit and a processing unit. The motion sensing unit senses a first motion to generate a corresponding first signal. The processing unit generates a first trajectory to determine a first region in the image area in response to the corresponding first signal for a decision whether the icon shall be or has been selected according to a relationship between the first region and a second region where the icon is displayed in the image area.

Abstract: A secure remote control apparatus having a motion is provided. The secure remote control apparatus includes a determining device and a signaling unit. The determining device produces a first signal in response to the motion. The signaling unit transmits a plurality of signals associated with the first signal, wherein each of the plurality of signals has a respective transmitting direction. The secure remote control apparatus ensure that the receiver of the electronic apparatus controlled by the secure remote control apparatus still can receive a signal associated with at least one of the plural infrared signals when the secure remote control apparatus is waved.

Abstract: A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

Abstract: A selection device for selecting an icon in an image area is provided including a motion-sensing unit and a processing unit. The motion-sensing unit senses a first motion and converts the first motion into a first signal. The processing unit converts the first signal into a first locus in the image area, determines a first area in the image area according to the first locus, and determines whether the icon is to be selected according to the first area and a second area where the icon is to be displayed in the image area.

Abstract: A home entertainment system includes a first audio/video device and a remote controller. The first audio/video device has a wireless signal receiver. The remote controller includes a main body, a motion-sensing unit, a microprocessor, and wireless transmission unit. The main body is held by a user. The motion-sensing unit is disposed within the main body for generating a sensing signal in response to a motion of the main body by the user. The microprocessor is disposed within the main body and communicates with the motion-sensing unit for processing the sensing signal, thereby generating a control signal. The wireless transmission unit communicates with the microprocessor for receiving the control signal and wirelessly transmitting the control signal to the wireless signal receiver. A first selective item of an electronic menu shown on the first audio/video device is highlighted according to the control signal.

Abstract: A package-base structure of a luminescent diode and its fabricating process. The package-base structure includes a substrate having thereon a holding space; an insulating layer extending from a bottom surface of the holding space to the bottom of the substrate; an through hole defined in the insulating layer; and a conductive layer disposed over the insulating layer. The insulating layer decouples the current flow and heat flow to increase the lifetime of the package-base structure together with the luminescent diode. In the fabricating process, the insulating layer is formed by anodic etching to allow the insulating layer have a porous structure.

Abstract: A side-view optical diode package is mounted on a printed circuit board with at least a solder bump. The side-view optical diode package includes a silicon substrate, a holding space, a bonding surface and a positioning structure. The silicon substrate has a first surface and a second surface. The holding space has a top opening in the first surface and a bottom for holding an optical diode thereon. The bonding surface is disposed at a lateral side of the silicon substrate and bonded onto the printed circuit board. The positioning structure has at least a solder-receiving portion beside the bonding surface and corresponding to the solder bump. The solder bump is molten during a soldering process and received in the solder-receiving portion, thereby facilitating positioning the silicon substrate on the printed circuit board.

Abstract: This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a package carrier, a conducting material, at least one light emitting diode structure and a package material. The package carrier has at least one package unit and two through holes on the package carrier and corresponding to the package unit. The conducting material is disposed in the through holes and formed at the bottom of the package unit. The light emitting diode structure is formed on a substrate. The substrate having a light emitting diode structure is flipped over in the package unit, and the electrodes of the light emitting diode structure are bonded with the conducting material. After the substrate is removed, a package material is stuffed in the package unit or on the light emitting diode structure.