Patents by Inventor Deng Kong SOH

Deng Kong SOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COMPOSITE ENCAPSULATION MATERIAL AND OPTICAL DEVICE OF THE SAME
    Publication number: 20240136482
    Abstract: A composite encapsulation material is provided, which includes (A) a polymer glue material and (B) a viscosity modifier. The viscosity modifier (B) has a functional group capable of forming non-covalent interaction with the polymer glue material (A). At room temperature, the ratio (log(?0)/log(?28 )) of the logarithm of the viscosity ((log(?0)) of the composite encapsulation material at the shear rate of 1×10?3 s?1 to the logarithm of the viscosity (log(??)) of the composite encapsulation material at the shear rate of 1×102 s?1 is 1.1-2.5.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 25, 2024
    Inventors: Deng Kong SOH, Wen Wan TAI, Yu-Chun LEE