Patents by Inventor Deng Tswen Shieh

Deng Tswen Shieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit socket with contact pad
    Publication number: 20010012707
    Abstract: An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises: (1) a base unit, it further consists of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) an interposer, there are a flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) an adapter unit, the unit is capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit.
    Type: Application
    Filed: April 5, 2001
    Publication date: August 9, 2001
    Applicant: Urex Precision, Inc.
    Inventors: Han-Shin Ho, Wei-Hai Lai, Chien-Shuan Kuo, Deng-Tswen Shieh, Ming-Hsien Wang, Chin-Ting Whung