Abstract: The integrity of the interconnects in a predefined micro-chip-module are tested in two phases. Before any integrated circuit chips are loaded onto the micro-chip-module, the capacitance value of each interconnect is measured and the measured capacitance value is compared with a predetermined range of acceptable values to establish if an interconnect error exists. The measurement and comparison process is repeated after a predefined set of integrated circuit chips are loaded onto the micro-chip-module. The capacitance of each interconnect node is indicative of the total length of the interconnect traces of the node, and thus a short circuit will result in a capacitance measurement above the predetermined range for the node, and an open circuit will result in a capacitance measurement below the predetermined range for the node.

Abstract: An embodiment of the present invention is a temperature forcing system and method for precision temperature control of a device-under-test. The system comprises a thermal test head suspended by a support arm that receives a temperature controlled air flow through an output hose from an air supply system. A pair of temperature sensors, one attached to the device-under-test and the other in the output hose, are used differentially by a closed-loop temperature controller when the temperature of the device-under-test comes within a temperature window surrounding a target temperature setpoint point. Outside the temperature window control is linear and within the temperature window control is compensated by a correction factor obtained during a single calibration test that amalgamates the effects of the mass of the device-under-test, the ambient conditions and other factors.