Abstract: This application discloses an optical lens, a camera module, and an electronic device. The optical lens includes a first lens group and a second lens group that are arranged from an object side to an image side, where the first lens group has positive focal power, the second lens group has negative focal power, and the first lens group and/or the second lens group are/is focusing lens groups/a focusing lens group. In a focusing process in which the optical lens switches from a long shot to a close-up shot, a spacing between the first lens group and the second lens group increases, and an effective focal length of the optical lens decreases. The optical lens satisfies a relational expression: F2/EFL>?5, where F2 is a focal length of the second lens group, and EFL is the effective focal length of the optical lens.

Abstract: The present disclosure relates to an insulating coating, which comprises the following components: a water-soluble metal inorganic salt A containing a water-soluble phosphate A1, which comprises a water-soluble phosphate of at least one of aluminum, zinc, magnesium and manganese; a water dispersible organic emulsion B, which comprises at least one of an epoxy emulsion and a curing agent thereof, polyester, polyurethane, polyacrylate and an ethylene-vinyl acetate copolymer; an additive C, which comprises at least one of a structure reinforcing additive C1 and a heat-resistance reinforcing additive C2, wherein the structure reinforcing additive C1 comprises an inorganic nanoparticulate matter, and the heat-resistance reinforcing additive C2 is selected from at least one of boric acid and a water-soluble salt of molybdenum, tungsten, vanadium or titanium; an auxiliary agent D1 and a solvent D2, wherein the solid content ratio of the water-soluble metal inorganic salt A to the water dispersible organic emulsion B

Abstract: In a method for determining a superconducting impedance matched parametric amplifier, a center wavelength parameter, a gain parameter, and a bandwidth parameter of the superconducting impedance matched parametric amplifier are determined. An impedance value of an impedance matching line of the superconducting impedance matched parametric amplifier and a capacitance value of the amplifier are determined based on the wavelength parameter, the gain parameter, and the bandwidth parameter. A line width dimension of a coplanar waveguide of the superconducting impedance matched parametric amplifier is calculated based on the impedance value of the impedance matching line. A stub dimension of the superconducting impedance matched parametric amplifier is calculated based on the impedance value of the impedance matching line and the capacitance value of the amplifier.

Abstract: An electronic device includes a camera assembly and an image stabilization motor. The image stabilization motor includes a base, a movable assembly, a suspension assembly, a driving assembly, and a first flexible circuit board. The movable assembly is disposed at the bottom of the base, and includes a main circuit board and an image sensor. One end of the first flexible circuit board is connected to an end surface of the main circuit board, the other end of the first flexible circuit board is connected to a board-to-board connector, and at least a portion of the first flexible circuit board is attached to a side wall of the base. A mover is configured to drive, under an action of a stator, the movable assembly to shift and roll on a plane on which an image sensor is located.

Abstract: A camera module includes a planoconvex lens, a first reflector, a focusing lens, a prime lens, a second reflector, a chip module, and a stabilization motor that are sequentially arranged from an object side to an image side. The first reflector is configured to direct an optical axis from a first direction to a second direction. The second reflector is configured to direct the optical axis from the second direction to a third direction. In this way, the photosensitive surface of the chip module may not be limited by a size of the camera module in a direction that is perpendicular to the second direction, and a large photosensitive surface design of the photosensitive surface of the chip module can be implemented.

Abstract: A chip preparation method and system, and a chip are provided. The method includes: preparing, by using a laser direct writing exposure manner, a first underlying circuit of an impedance Josephson parametric amplifier and a second underlying circuit for testing, to obtain a first chip product; generating, on the first chip product by using the laser direct writing exposure manner, a photoresist structure for preparing a Josephson junction; cutting, from the first chip product, a second chip product on which the second underlying circuit is located and a third chip product on which the first underlying circuit is located; preparing a Josephson junction sample based on a photoresist structure corresponding to the second underlying circuit, to obtain an oxidation condition; and preparing, according to the oxidation condition, the Josephson junction based on a photoresist structure corresponding to the first underlying circuit.

Abstract: A voice coil motor for driving a liquid lens and a lens assembly having a voice coil motor, where the voice coil motor includes a plurality of sub motor parts. The sub motor parts can be independently controlled. The sub motor part includes an unmovable part, a movable part, which can move along an optical axis direction relative to the unmovable part, a connection elastic piece coupled to the liquid lens and the movable part, where when a force is applied to the movable part in the optical axis direction, the movable part drives the connection elastic piece to squeeze the liquid lens.

Abstract: A fish-like shape robotic device includes a fish-like shape carrier portion, a vibrable tail portion, a wireless power receiving module, a driving module, and at least one functional sensor. The fish-like shape carrier portion includes a head portion and a pair of side portions. The wireless power receiving module is configured to receive a wireless power and disposed on the vibrable tail portion and the side portions. The driving module is disposed on the vibrable tail portion, in which the wireless power receiving module transmits the wireless power to the driving module, such that the driving module enables the vibrable tail portion vibrate. The at least one functional sensor is disposed at the head portion and configured to sense a characteristic of an aquatic environment, or detect a living body or a bio-like structure in the aquatic environment, so as to obtain at least one sensing electrical signal.

Abstract: In a circuit layout processing method, an initial circuit layout of a chip is obtained. The initial circuit layout includes initial position information of a line in the chip. A correction value of the line is obtained. The correction value is set based on an etching processing error of the chip. A boundary of the line in the initial circuit layout is corrected based on the initial position information and the correction value to obtain a corrected circuit layout.

Abstract: A variable aperture, a camera module, and an electronic device are provided. The variable aperture includes a base, a fixed plate connected to the base, a rotation plate disposed around the fixed plate, a plurality of blades rotatively connected to the fixed plate and the rotation plate, a first SMA wire, and a second SMA wire. The first SMA wire or the second SMA wire is configured to shrink when power is on, to drive the rotation plate to rotate relative to the fixed plate. Each of the blades rotates relative to the fixed plate and slides relative to the rotation plate, so that an aperture of the aperture hole changes.

Abstract: A camera system includes a module frame, a camera lens, an image sensor, and an SMA motor that are stacked within the module frame. The camera lens is fixedly connected to the module frame, and the SMA motor is located on an out-light side of the camera lens. The image sensor is located between the camera lens and the SMA motor and is fastened to the SMA motor. The SMA motor is configured to actuate the image sensor to shift in a direction parallel to an optical axis of the camera lens. The SMA motor is further configured to actuate the image sensor to shift on a plane perpendicular to the optical axis of the camera lens.

Abstract: An induction heating system for a silicon steel core with a self-adhesive coating that includes an induction heating device having a columnar induction heating coil with a hollow cavity that carries out induction heating on a silicon steel plate at a medium frequency of 6-20 KHz. By rapid induction heating at a medium frequency, a silicon steel core with a self-adhesive coating can be rapidly cured, thereby greatly shortening the processing time, improving production efficiency, and facilitating automated operation in the production of a silicon steel core with a self-adhesive coating. The system also ensures the quality of the cured core products that can be widely applied in the field of the production of silicon steel cores with a self-adhesive coating.

Abstract: A pan-tilt-zoom device includes a housing, a carrier, an image sensor, and a shape memory alloy (SMA) motor. An accommodating cavity is formed in the housing, and a first opening in communication with the accommodating cavity is provided on the housing. The carrier is located in the accommodating cavity, the carrier has a lens mounting hole, and an opening at one end of the lens mounting hole faces the first opening. The image sensor is located in the accommodating cavity and is disposed on a side that is of the carrier and that is away from the first opening, and a photosensitive surface of the image sensor faces an opening at the other end of the lens mounting hole. The SMA motor is configured to drive the carrier to tilt in the accommodating cavity along with the image sensor in any direction around, to implement optical image stabilization.

Abstract: This application provides a driving apparatus and an electronic device. The driving apparatus may be applied to the electronic device. The driving apparatus includes a variable aperture. A piezoelectric ceramic of the variable aperture is configured to deform under signal control, to drive a rotation ring of the variable aperture to rotate relative to a base of the variable aperture. Each blade of the variable aperture rotates relative to the rotation ring and slides relative to a first protrusion part of the base, and a hole diameter of an aperture hole of the variable aperture changes. A change range of the aperture hole of the variable aperture in this application is not easily affected by an external magnetic force of the variable aperture.

Abstract: This application provides a camera module and an electronic device, and relates to the field of electronic device technologies. The camera module includes an optical camera lens, a variable aperture, and an SMA motor. The variable aperture has an aperture hole whose size is adjustable. The SMA motor includes a first carrier, a base, and an SMA drive assembly. The optical camera lens is fastened to the first carrier. The SMA drive assembly is connected between the first carrier and the base. The SMA drive assembly is configured to drive the first carrier, the optical camera lens, and the variable aperture to move together relative to the base, so as to implement automatic focusing and/or optical image stabilization.

Abstract: Authorization is divided between a control plane and a data plane for sharing database data. A producer database engine can create a shared database via a data plane interface. A producer can then authorize access to the shared database via a control plane interface to a consumer. A consumer can associate the authorization granted to the consumer with a consumer database engine via the control plane interface.

Abstract: A method and system for preparing a Josephson junction is disclosed, relates to the technical field of micro-nano processing. The method includes: preparing a circuit structure on a substrate by nano-imprinting, the circuit structure comprising a first lead, a second lead, and a peripheral circuit connected to the first and second leads; preparing a photoresist-based undercut structure on the substrate; the undercut structure comprising a first region and a second region having upper photoresist layers and lower layers of hollow-out; the second region being an opening region of the undercut structure; preparing an oxide layer on a surface of the second lead which is not covered by the photoresist; evaporating a first superconducting layer obliquely in a direction from the first region to the second region to obtain the Josephson junction; and evaporating a second superconducting layer obliquely in a direction from the second region to the first region.

Abstract: This application provides a method for preparing a quantum chip. The method includes the following steps: determining an initial eigenfrequency of a chip substrate; performing, based on a numerical comparison result between the initial eigenfrequency and a quantum operating frequency, pattern etching on a first surface of the chip substrate to obtain a chip substrate with an intact second surface and the first surface with a target pattern, wherein the quantum operating frequency is an operating frequency of a quantum bit of a quantum circuit, the second surface is opposite to the first surface, and the target pattern is a pattern when a difference between the initial eigenfrequency of the chip substrate and the quantum operating frequency is maximum; and etching, on the second surface of the pattern-etched chip substrate, the quantum circuit to form the quantum chip.

Abstract: A method and device for preparing a Josephson junction are provided. The method includes: preparing a photoresist film layer comprising an undercut structure on a substrate, the undercut structure comprising a first strip-shaped opening and a second strip-shaped opening; performing, at a first angle, evaporation on the photoresist film layer obliquely to the substrate, to prepare a first strip-shaped superconducting layer through the first strip-shaped opening; and performing, at a second angle, evaporation on the photoresist film layer obliquely to the substrate, to prepare a second strip-shaped superconducting layer through the second strip-shaped opening, the first strip-shaped superconducting layer and the second strip-shaped superconducting layer crossing each other, and an intersection of the first strip-shaped superconducting layer and the second strip-shaped superconducting layer being isolated by an oxidation layer to form a Josephson junction.

Abstract: Disclosed are a silicon wafer and a method for filling a silicon via thereof, and belong to the field of superconducting quantum technologies. The method includes: obtaining a silicon wafer including at least one silicon via; providing a superconducting material on at least one side of the silicon wafer, the at least one side comprising a side where an opening of the silicon via is located; and heating and pressurizing the superconducting material to fill the superconducting material into the silicon via.