Patents by Inventor Denglin Li

Denglin Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10820112
    Abstract: The speaker of the present invention comprises a frame, a vibration system and a magnetic circuit system. The vibration system comprises a diaphragm and a voice coil assembly for driving the vibration of the diaphragm for generating sound, the diaphragm is located on the frame, and the voice coil assembly is connected with the diaphragm and the magnetic circuit system includes a first clamping plate, a yoke, and a main magnetic and a sub magnetic disposed in the yoke. Wherein the bonding portion of the first clamping plate and the sub magnetic is provided with an adhesive groove recessed from the bonding portion away from the sub magnetic. When the first clamping plate is bonded to the sub magnetic, the glue is filled between the first clamping plate and the sub magnetic and filled in the adhesive groove.
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: October 27, 2020
    Assignee: AAC Technologies Pte. Ltd.
    Inventor: Denglin Li
  • Publication number: 20200045462
    Abstract: The speaker of the present invention comprises a frame, a vibration system and a magnetic circuit system. The vibration system comprises a diaphragm and a voice coil assembly for driving the vibration of the diaphragm for generating sound, the diaphragm is located on the frame, and the voice coil assembly is connected with the diaphragm and the magnetic circuit system includes a first clamping plate, a yoke, and a main magnetic and a sub magnetic disposed in the yoke. Wherein the bonding portion of the first clamping plate and the sub magnetic is provided with an adhesive groove recessed from the bonding portion away from the sub magnetic. When the first clamping plate is bonded to the sub magnetic, the glue is filled between the first clamping plate and the sub magnetic and filled in the adhesive groove.
    Type: Application
    Filed: July 29, 2019
    Publication date: February 6, 2020
    Inventor: Denglin Li