Abstract: A storage device is disclosed herein. The storage device comprises: a non-volatile memory, where the non-volatile memory includes a block of N wordlines partitioned into a plurality of sub-blocks and the plurality of sub-blocks includes a first sub-block of a first subset of the block of N wordlines and a second sub-block of a second subset of the block of N wordlines; and control circuitry coupled to the block of N wordlines. The control circuitry is configured to: perform a program operation in a normal order programming sequence on the first sub-block; perform a sensing operation on the first sub-block using a reverse sensing scheme; perform a program operation in a reverse order programming sequence on the second sub-block; and perform a sensing operation on the second sub-block using a regular sensing scheme.

Abstract: An array substrate and a manufacturing method thereof are disclosed. The manufacturing method includes forming, on a substrate, a first metal pattern layer, a first insulating layer, a second metal pattern layer, and a second insulating layer, successively; coating a photoresist on the second insulating layer; forming a photoresist pattern and an etching protection layer, in a first region of the array substrate, the photoresist pattern exposing a part of the top surface of the second insulating layer, and being coupled to the second insulating layer through the etching protection layer; and performing etching in the first region by using the photoresist pattern as a mask to remove the etching protection layer and at least part of the second insulating layer, without etching the first insulating layer, so as to expose a part of the second metal pattern layer and form a liquid crystal diversion groove.

Abstract: The present disclosure provides a wet etching machine and an etching method. The wet etching machine including an etching chamber in which at least two etching layers are disposed. The etching layers are successively overlapped with each other from up to down, and each etching layer includes a first transfer carrier for receiving and transferring a substrate to be etched and a spraying apparatus disposed right above the first transfer carrier for spraying etching solution. When the total etching time is needed to be longer than the transfer time of the substrate without stopping the substrate, the present disclosure can solve the problems in the prior art of causing the takt time decreased due to the stopping time of the substrate is required to be increased or causing the area of the facility increased due to the number of the etching chambers connected in series is required to be increased.

Abstract: An array substrate and a manufacturing method thereof are disclosed. The manufacturing method includes forming, on a substrate, a first metal pattern layer, a first insulating layer, a second metal pattern layer, and a second insulating layer, successively; coating a photoresist on the second insulating layer; forming a photoresist pattern and an etching protection layer, in a first region of the array substrate, the photoresist pattern exposing a part of the top surface of the second insulating layer, and being coupled to the second insulating layer through the etching protection layer; and performing etching in the first region by using the photoresist pattern as a mask to remove the etching protection layer and at least part of the second insulating layer, without etching the first insulating layer, so as to expose a part of the second metal pattern layer and form a liquid crystal is diversion groove.

Abstract: A liquid knife cleaning device is provided, and it includes a splash shield; a liquid knife, which is located under the splash shield; an oblique baffle, which is located between the splash shield and the liquid knife, and a lower side of which is fixedly bonded to the top of a blade of the liquid knife. The oblique baffle can act to isolate the liquid knife and the substrate on the delivery roll from a majority of water vapor, and droplets dripping on the oblique baffle can flow down along a slope of the oblique baffle, and will not drip on the substrate that has not been rinsed by the liquid knife. Effects of droplets on the uniformity of the substrate can be greatly reduced by the present technique, thereby enhancing the product quality.

Abstract: The present invention provides an array substrate, a method for manufacturing the same and a display device, and relates to technical field of displays. The method for manufacturing an array substrate comprises forming a metal layer on a substrate and removing superficial metallic oxide on the metal layer by a washing process. The method for manufacturing an array substrate according to the present inversion can remove the superficial metal oxide on the metal layer and improve the performance of a TFT.

Abstract: A liquid knife cleaning device is provided, and it includes a splash shield; a liquid knife, which is located under the splash shield; an oblique baffle, which is located between the splash shield and the liquid knife, and a lower side of which is fixedly bonded to the top of a blade of the liquid knife. The oblique baffle can act to isolate the liquid knife and the substrate on the delivery roll from a majority of water vapor, and droplets dripping on the oblique baffle can flow down along a slope of the oblique baffle, and will not drip on the substrate that has not been rinsed by the liquid knife. Effects of droplets on the uniformity of the substrate can be greatly reduced by the present technique, thereby enhancing the product quality.

Abstract: A system for wet etching. The system comprises an etching region, a buffer region and a washing region which are communicated in order. An air knife unit is provided at a position at which the buffer region and the clean region connects. The system further comprises a cleaning unit, which is provided correspondingly to the air knife unit, and is used for cleaning the air knife unit. The system efficiently removes the etchant crystal and dust particles attached to the knife edge and periphery of the air knife by means of the cleaning unit. The system can replace the manual cleaning of the air knife, improve operation rate of the device, and reduce waste of labor power as much as possible while ensuring the cleaning effect, while meanwhile avoiding increased particles that would otherwise affect the product yield as a result of lengthy openings of the device cavity.

Abstract: The present disclosure provides a wet etching machine and an etching method. The wet etching machine including an etching chamber in which at least two etching layers are disposed. The etching layers are successively overlapped with each other from up to down, and each etching layer includes a first transfer carrier for receiving and transferring a substrate to be etched and a spraying apparatus disposed right above the first transfer carrier for spraying etching solution. When the total etching time is needed to be longer than the transfer time of the substrate without stopping the substrate, the present disclosure can solve the problems in the prior art of causing the takt time decreased due to the stopping time of the substrate is required to be increased or causing the area of the facility increased due to the number of the etching chambers connected in series is required to be increased.

Abstract: The present invention provides an array substrate, a method for manufacturing the same and a display device, and relates to technical field of displays. The method for manufacturing an array substrate comprises forming a metal layer on a substrate and removing superficial metallic oxide on the metal layer by a washing process. The method for manufacturing an array substrate according to the present inversion can remove the superficial metal oxide on the metal layer and improve the performance of a TFT.