Patents by Inventor Dengyan YAN

Dengyan YAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128012
    Abstract: Surface mount inductor components include pre-formed coils with integrated bottom sunken features and simply shaped core pieces configured to create magnetic gaps in an assembled core structure around the coils when desired. The magnetic gaps interrupt flux paths in the operating components and provide swing-inductor functionality. The magnetic gaps may be reliably and economically provided in the form of interior or exterior grooves or depressed surfaces that may be easily formed in the core pieces while also facilitating ease of assembly of the inductor components.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Inventors: Yipeng Yan, Dengyan Zhou, Kyle Yun-Su Kim
  • Publication number: 20240100975
    Abstract: A contactor for a vehicle, includes: a first wiring terminal, a second wiring terminal, a conducting bar, and a driving assembly. A first conduction section and a second conduction section of the conducting bar are connected to each other and are configured to rotate with respect to each other. The first conduction section is fixed on the first wiring terminal, and the second conduction section is electrically connected to or electrically disconnected from the second wiring terminal. The driving assembly is configured to drive the second conduction section to move toward or away from the second wiring terminal. The first wiring terminal and the second wiring terminal are disposed opposite to the conducting bar in a first direction, the driving assembly is disposed opposite to the conducting bar, or the first wiring terminal, or the second wiring terminal in a second direction different from the first direction.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Tuodi HUANG, Xuechao WANG, Lei SHI, Dengyan YAN, Qing LIU