Patents by Inventor Dengying LEI

Dengying LEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190142044
    Abstract: The present invention discloses a microwave and conduction combined heating method for improving the gel strength of surimi products, belonging to the technical field of food processing. According to the present invention, surimi is first fully gelatinized by conduction heating, and then heated by microwave heating so that surimi gel can pass through a gel cracking zone quickly. This kind of microwave and conduction combined heating way can not only increase the gel strength of the surimi to achieve the desired elasticity, but also can save a lot of time and improve the production efficiency. Compared with ordinary microwave heating, the microwave and conduction combined heating method of the conduction and microwave heat preservation, i.e.
    Type: Application
    Filed: November 2, 2018
    Publication date: May 16, 2019
    Inventors: Daming FAN, Jianlian HUANG, Hongwei CAO, Xuepeng LI, Hao ZHANG, Wenguo ZHOU, Bowen YAN, Xidong JIAO, Tenghui YU, Wenhai ZHANG, Weijian YE, Jiangping CHEN, Dengying LEI, Jianxin ZHAO, Qingmiao ZHANG, Wei CHEN