Patents by Inventor Denica N. LARSEN
Denica N. LARSEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230244280Abstract: Various embodiments relate to an electronic device with a first panel and a second panel coupled by a hinge mechanism. The electronic device may include a first wire that communicatively couples components of the first panel with components of the second panel. The wire may pass through the hinge mechanism, and be tensioned by a tensioning mechanism that provides tension to the first wire when the electronic device is in an open position and a closed position. Other embodiments may be described and/or claimed.Type: ApplicationFiled: January 28, 2022Publication date: August 3, 2023Inventors: Denica N. Larsen, Ming-Chia Lee, Naoki Matsumura, Prosenjit Ghosh, Jordan E. Maslov, Peiwang Chen
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Patent number: 11313998Abstract: An embodiment of a method of manufacturing a cover lens for an electronic display includes etching a first surface geometry on a first surface of the cover lens. In the embodiment, the method includes determining a plurality of angles of refraction at the first surface from light generated from the electronic display based on the first surface geometry. In the embodiment, the method includes determining a second surface geometry for a second surface of the cover lens based on the plurality of angles of refraction at the first surface. In the embodiment, the method includes etching the second surface geometry on the second surface of the cover lens.Type: GrantFiled: December 27, 2019Date of Patent: April 26, 2022Assignee: Intel CorporationInventors: Shantanu D. Kulkarni, Prosenjit Ghosh, Michael Daniel Rosenzweig, Denica N. Larsen
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Patent number: 10838466Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.Type: GrantFiled: December 10, 2015Date of Patent: November 17, 2020Assignee: Intel CorporationInventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
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Publication number: 20200132892Abstract: An embodiment of a method of manufacturing a cover lens for an electronic display includes etching a first surface geometry on a first surface of the cover lens. In the embodiment, the method includes determining a plurality of angles of refraction at the first surface from light generated from the electronic display based on the first surface geometry. In the embodiment, the method includes determining a second surface geometry for a second surface of the cover lens based on the plurality of angles of refraction at the first surface. In the embodiment, the method includes etching the second surface geometry on the second surface of the cover lens.Type: ApplicationFiled: December 27, 2019Publication date: April 30, 2020Inventors: Shantanu D. Kulkarni, Prosenjit Ghosh, Michael Daniel Rosenzweig, Denica N. Larsen
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Patent number: 10618192Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.Type: GrantFiled: January 9, 2018Date of Patent: April 14, 2020Assignee: Intel CorporationInventors: Denica N. Larsen, Wing K. Ho
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Publication number: 20200019217Abstract: An electronic device has a body with a first portion (e.g., a lid) and a second portion (e.g., a base). The first portion includes magnets, while the second portion includes attractive elements that the magnets are attracted to. The first and second portions may be coupled together with hinges. The force of magnetic attraction between the magnets and the attractive elements maintain the body in a closed configuration at certain orientations of the body (e.g., at certain angles that the body is tilted relative to an axis in the direction of the Earth's gravity). When the body is positioned at a threshold angle with respect to the axis in the direction of the Earth's gravity, a separating force acting on the (first or second) portion of the body that is closer to the Earth becomes greater than the force of magnetic attraction, causing the portions to separate and the body to be in an open configuration.Type: ApplicationFiled: September 25, 2019Publication date: January 16, 2020Inventors: Denica N. Larsen, Prosenjit Ghosh, Shantanu D. Kulkarni
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Patent number: 10331177Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.Type: GrantFiled: September 25, 2015Date of Patent: June 25, 2019Assignee: Intel CorporationInventors: Prosenjit Ghosh, Denica N. Larsen, James M. Okuley, Hong W. Wong
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Publication number: 20190041918Abstract: Embodiments include apparatuses, methods, and systems for computing. A computing apparatus may include a first computing part and a second computing part. The first computing part and the second computing part may be attached to a spine assembly. The first computing part may include a first electronic interface and a first mechanical attachment coupler to be coupled to the spine assembly, while the second computing part may include a second electronic interface and a second mechanical attachment coupler to be coupled to the spine assembly. The first computing part or the second computing part may rotate around a rotation hinge of the spine assembly from a first position to a second position. Other embodiments may also be described and claimed.Type: ApplicationFiled: June 27, 2018Publication date: February 7, 2019Inventors: Denica N. Larsen, Prosenjit Ghosh, Murali Veeramoney, Praveen Vishakantaiah
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Publication number: 20180348825Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.Type: ApplicationFiled: December 10, 2015Publication date: December 6, 2018Applicant: Intel CorporationInventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
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Publication number: 20180329462Abstract: An apparatus including a hinge assembly is described herein. The hinge assembly including a plurality of substantially parallel hinges, each said hinge of the plurality being attached to at least one adjacent said hinge, wherein a first outermost hinge is coupled to a first housing and a second outermost hinge is coupled to a second housing, each said hinge of the plurality to provide a respective range of rotation to the hinge assembly such that the first and second housings may be rotated relative to each other about the hinge assembly within a range of approximately between 0 degrees and 360 degrees.Type: ApplicationFiled: December 26, 2015Publication date: November 15, 2018Applicant: INTEL CORPORATIONInventors: Denica N. Larsen, Chunlin Bai, Prosenjit Ghosh
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Publication number: 20180246546Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.Type: ApplicationFiled: September 25, 2015Publication date: August 30, 2018Applicant: Intel CorporationInventors: Prosenjit Ghosh, Denica N. Larsen, James M. Okuley, Hong W. Wong
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Publication number: 20180154544Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: January 9, 2018Publication date: June 7, 2018Applicant: Intel CorporationInventors: Denica N. Larsen, Wing K. Ho
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Patent number: 9964989Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a first body coupled to a first housing, a second body coupled to a second housing, and two or more taut flexible bands, wherein the taut flexible bands couple the first body to the second body and allow for timed rotation of the first housing relative to the second housing. In some examples, the hinge is a low profile hinge and can rotate about three hundred and sixty degrees.Type: GrantFiled: December 24, 2015Date of Patent: May 8, 2018Assignee: Intel CorporationInventors: Raul Krivoy, Denica N. Larsen
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Patent number: 9862115Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.Type: GrantFiled: March 27, 2015Date of Patent: January 9, 2018Assignee: Intel CorporationInventors: Denica N. Larsen, Wing K. Ho
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Publication number: 20170185104Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a first body coupled to a first housing, a second body coupled to a second housing, and two or more taut flexible bands, wherein the taut flexible bands couple the first body to the second body and allow for timed rotation of the first housing relative to the second housing. In some examples, the hinge is a low profile hinge and can rotate about three hundred and sixty degrees.Type: ApplicationFiled: December 24, 2015Publication date: June 29, 2017Applicant: Intel CorporationInventors: Raul Krivoy, Denica N. Larsen
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Patent number: D822658Type: GrantFiled: June 30, 2016Date of Patent: July 10, 2018Assignee: Intel CorporationInventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
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Patent number: D846545Type: GrantFiled: June 6, 2018Date of Patent: April 23, 2019Assignee: Intel CorporationInventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
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Patent number: D847810Type: GrantFiled: June 6, 2018Date of Patent: May 7, 2019Assignee: Intel CorporationInventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
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Patent number: D888711Type: GrantFiled: February 19, 2019Date of Patent: June 30, 2020Assignee: Intel CorporationInventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
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Patent number: D1003894Type: GrantFiled: June 1, 2020Date of Patent: November 7, 2023Assignee: Intel CorporationInventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar