Patents by Inventor Denica N. LARSEN

Denica N. LARSEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230244280
    Abstract: Various embodiments relate to an electronic device with a first panel and a second panel coupled by a hinge mechanism. The electronic device may include a first wire that communicatively couples components of the first panel with components of the second panel. The wire may pass through the hinge mechanism, and be tensioned by a tensioning mechanism that provides tension to the first wire when the electronic device is in an open position and a closed position. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: January 28, 2022
    Publication date: August 3, 2023
    Inventors: Denica N. Larsen, Ming-Chia Lee, Naoki Matsumura, Prosenjit Ghosh, Jordan E. Maslov, Peiwang Chen
  • Patent number: 11313998
    Abstract: An embodiment of a method of manufacturing a cover lens for an electronic display includes etching a first surface geometry on a first surface of the cover lens. In the embodiment, the method includes determining a plurality of angles of refraction at the first surface from light generated from the electronic display based on the first surface geometry. In the embodiment, the method includes determining a second surface geometry for a second surface of the cover lens based on the plurality of angles of refraction at the first surface. In the embodiment, the method includes etching the second surface geometry on the second surface of the cover lens.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: April 26, 2022
    Assignee: Intel Corporation
    Inventors: Shantanu D. Kulkarni, Prosenjit Ghosh, Michael Daniel Rosenzweig, Denica N. Larsen
  • Patent number: 10838466
    Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: November 17, 2020
    Assignee: Intel Corporation
    Inventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
  • Publication number: 20200132892
    Abstract: An embodiment of a method of manufacturing a cover lens for an electronic display includes etching a first surface geometry on a first surface of the cover lens. In the embodiment, the method includes determining a plurality of angles of refraction at the first surface from light generated from the electronic display based on the first surface geometry. In the embodiment, the method includes determining a second surface geometry for a second surface of the cover lens based on the plurality of angles of refraction at the first surface. In the embodiment, the method includes etching the second surface geometry on the second surface of the cover lens.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Shantanu D. Kulkarni, Prosenjit Ghosh, Michael Daniel Rosenzweig, Denica N. Larsen
  • Patent number: 10618192
    Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: April 14, 2020
    Assignee: Intel Corporation
    Inventors: Denica N. Larsen, Wing K. Ho
  • Publication number: 20200019217
    Abstract: An electronic device has a body with a first portion (e.g., a lid) and a second portion (e.g., a base). The first portion includes magnets, while the second portion includes attractive elements that the magnets are attracted to. The first and second portions may be coupled together with hinges. The force of magnetic attraction between the magnets and the attractive elements maintain the body in a closed configuration at certain orientations of the body (e.g., at certain angles that the body is tilted relative to an axis in the direction of the Earth's gravity). When the body is positioned at a threshold angle with respect to the axis in the direction of the Earth's gravity, a separating force acting on the (first or second) portion of the body that is closer to the Earth becomes greater than the force of magnetic attraction, causing the portions to separate and the body to be in an open configuration.
    Type: Application
    Filed: September 25, 2019
    Publication date: January 16, 2020
    Inventors: Denica N. Larsen, Prosenjit Ghosh, Shantanu D. Kulkarni
  • Patent number: 10331177
    Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: June 25, 2019
    Assignee: Intel Corporation
    Inventors: Prosenjit Ghosh, Denica N. Larsen, James M. Okuley, Hong W. Wong
  • Publication number: 20190041918
    Abstract: Embodiments include apparatuses, methods, and systems for computing. A computing apparatus may include a first computing part and a second computing part. The first computing part and the second computing part may be attached to a spine assembly. The first computing part may include a first electronic interface and a first mechanical attachment coupler to be coupled to the spine assembly, while the second computing part may include a second electronic interface and a second mechanical attachment coupler to be coupled to the spine assembly. The first computing part or the second computing part may rotate around a rotation hinge of the spine assembly from a first position to a second position. Other embodiments may also be described and claimed.
    Type: Application
    Filed: June 27, 2018
    Publication date: February 7, 2019
    Inventors: Denica N. Larsen, Prosenjit Ghosh, Murali Veeramoney, Praveen Vishakantaiah
  • Publication number: 20180348825
    Abstract: Particular embodiments described herein provide for device that includes a first housing, a second housing, and a hinge, configured as an antenna, to rotatably couple the first housing and the second housing.
    Type: Application
    Filed: December 10, 2015
    Publication date: December 6, 2018
    Applicant: Intel Corporation
    Inventors: David A. Rittenhouse, Manish A. Hiranandani, Denica N. Larsen, Anand S. Konanur, Hong W. Wong, Ulun Karacaoglu
  • Publication number: 20180329462
    Abstract: An apparatus including a hinge assembly is described herein. The hinge assembly including a plurality of substantially parallel hinges, each said hinge of the plurality being attached to at least one adjacent said hinge, wherein a first outermost hinge is coupled to a first housing and a second outermost hinge is coupled to a second housing, each said hinge of the plurality to provide a respective range of rotation to the hinge assembly such that the first and second housings may be rotated relative to each other about the hinge assembly within a range of approximately between 0 degrees and 360 degrees.
    Type: Application
    Filed: December 26, 2015
    Publication date: November 15, 2018
    Applicant: INTEL CORPORATION
    Inventors: Denica N. Larsen, Chunlin Bai, Prosenjit Ghosh
  • Publication number: 20180246546
    Abstract: Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.
    Type: Application
    Filed: September 25, 2015
    Publication date: August 30, 2018
    Applicant: Intel Corporation
    Inventors: Prosenjit Ghosh, Denica N. Larsen, James M. Okuley, Hong W. Wong
  • Publication number: 20180154544
    Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: January 9, 2018
    Publication date: June 7, 2018
    Applicant: Intel Corporation
    Inventors: Denica N. Larsen, Wing K. Ho
  • Patent number: 9964989
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a first body coupled to a first housing, a second body coupled to a second housing, and two or more taut flexible bands, wherein the taut flexible bands couple the first body to the second body and allow for timed rotation of the first housing relative to the second housing. In some examples, the hinge is a low profile hinge and can rotate about three hundred and sixty degrees.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: May 8, 2018
    Assignee: Intel Corporation
    Inventors: Raul Krivoy, Denica N. Larsen
  • Patent number: 9862115
    Abstract: Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: March 27, 2015
    Date of Patent: January 9, 2018
    Assignee: Intel Corporation
    Inventors: Denica N. Larsen, Wing K. Ho
  • Publication number: 20170185104
    Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). One particular example implementation of the electronic device may include a first body coupled to a first housing, a second body coupled to a second housing, and two or more taut flexible bands, wherein the taut flexible bands couple the first body to the second body and allow for timed rotation of the first housing relative to the second housing. In some examples, the hinge is a low profile hinge and can rotate about three hundred and sixty degrees.
    Type: Application
    Filed: December 24, 2015
    Publication date: June 29, 2017
    Applicant: Intel Corporation
    Inventors: Raul Krivoy, Denica N. Larsen
  • Patent number: D822658
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 10, 2018
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
  • Patent number: D846545
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: April 23, 2019
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
  • Patent number: D847810
    Type: Grant
    Filed: June 6, 2018
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
  • Patent number: D888711
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: June 30, 2020
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar
  • Patent number: D1003894
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: November 7, 2023
    Assignee: Intel Corporation
    Inventors: Jim Okuley, Murali Veeramoney, Prosenjit Ghosh, Denica N Larsen, Martin Bone, Gregory Germe, Hong W. Wong, Arvind Kumar