Abstract: Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.

Abstract: The present invention provides a multilayer body of an inorganic substrate and a heat-resistant polymer film, the multilayer body being suppressed in vibrations during handling. A multilayer body of a heat-resistant polymer film and an inorganic substrate according to the present invention does not substantially use an adhesive and is characterized in that: the heat-resistant polymer film is transparent; the tensile elastic modulus E1 (GPa) and the thickness T1 (?m) of the multilayer body satisfy formula (1); and the storage elastic modulus E2 (GPa) at 280° C. and the thickness T1 (?m) of the multilayer body satisfy formula (2).

Abstract: The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.

Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.

Abstract: Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250° C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250° C.

Abstract: Provided is a layered product that uses a high temperature-resistant transparent film having sufficient heat resistance, and that is capable of being mechanically released from an inorganic substrate after various processes are performed on the inorganic substrate since the adhesive strength between the high temperature-resistant transparent film and the inorganic substrate is appropriately weak, and that is less warped along with the inorganic substrate. In this layered product, no adhesive is used between the high temperature-resistant transparent film and the inorganic substrate, the release strength between the high temperature-resistant transparent film and the inorganic substrate is at most 0.3 N/cm, and the warpage amount of the layered product when heated at 300° C. is at most 400 µm.

Abstract: The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant transparent film which has sufficient heat resistance and is able to be mechanically separated from the inorganic substrate after being subjected to various processes on the inorganic substrate since the adhesion between the highly heat-resistant transparent film and the inorganic substance is adequately weak. A multilayer body of a highly heat-resistant transparent film and an inorganic substrate, wherein: an adhesive is not substantially used; the peel strength between the highly heat-resistant transparent film and the inorganic substrate is 0.3 N/cm or less; and the CTE of the highly heat-resistant transparent film is 50 ppm/K or less.

Abstract: The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.