Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.

Abstract: An image sensor capable of capturing an image formed by a lens includes a substrate and a bonding wire. The substrate has a pixel array and a bonding pad on a top surface of the substrate between the pixel array and a substrate edge. The bonding wire is electrically connected to the bonding pad and has a region forming a non-zero angle with respect to the substrate top surface. The non-zero angle is in at least one of a lower and an upper angular range for minimizing reflection of incident light on the region from reaching the image sensor. The lower angular range is selected such that the region reflects the incident light away from the pixel array toward a plane including the lens. The upper angular range is selected such that the region reflects the incident light to a clearance between the bonding pad and the pixel array.

Abstract: Embodiments of the invention describe an enclosure for an image capture system that includes an image capture unit and a solid state die to provide focusing capabilities for a lens unit of the image capture unit. The enclosure may electrically couple the solid state die to the image capture unit and/or other system circuitry. The enclosure may further serve as EMI shielding for the image capture system.

Abstract: Embodiments of the invention describe providing image focusing capabilities for a lens unit of an image capture system by disposing a solid state die over the lens unit. The solid state die may include a plurality of electrodes to receive a voltage or electric signal to generate an electric field. The refractive index of the solid state die will change in response to the generated electric field to focus the image or scene captured by the lens unit. The solid state die is mounted to a folded flexible printed circuit board in a housing or a molded housing having electrodes on its inner wall.

Abstract: Embodiments of the invention describe providing image focusing capabilities for a lens unit of an image capture system by disposing a solid state die over the lens unit. The solid state die may include a plurality of electrodes to receive a voltage or electric signal to generate an electric field. The refractive index of the solid state die will change in response to the generated electric field to focus the image or scene captured by the lens unit. The solid state die is mounted to a folded flexible printed circuit board in a housing or a molded housing having electrodes on its inner wall.

Abstract: Embodiments of the invention describe an enclosure for an image capture system that includes an image capture unit and a solid state die to provide focusing capabilities for a lens unit of the image capture unit. The enclosure may electrically couple the solid state die to the image capture unit and/or other system circuitry. The enclosure may further serve as EMI shielding for the image capture system.