Abstract: The invention relates to a millimeter frequency oscillator using integrated circuit technology. The oscillator includes a microwave output (Sf) providing an oscillation frequency Fout as a function of a control signal Vt. The oscillation frequency Fout may be modulated around a central frequency Fc via two control inputs of the oscillator, a first control input Ec1 driven by a first control signal Vt1 fixing the central frequency Fc of the oscillator and a second control input Ec2 driven by a second control signal Vt2 allowing linear modulation of this central frequency Fc. The control signal Vt of the oscillator is a function of the two control signals Vt1 and Vt2.

Abstract: The invention relates to a millimeter frequency oscillator using integrated circuit technology. The oscillator includes a microwave output (Sf) providing an oscillation frequency Fout as a function of a control signal Vt. The oscillation frequency Fout may be modulated around a central frequency Fc via two control inputs of the oscillator, a first control input Ec1 driven by a first control signal Vt1 fixing the central frequency Fc of the oscillator and a second control input Ec2 driven by a second control signal Vt2 allowing linear modulation of this central frequency Fc. The control signal Vt of the oscillator is a function of the two control signals Vt1 and Vt2.

Abstract: The invention relates to millimetric packaged electronic components for applications at high frequencies greater than 45 GHz. According to the invention, to facilitate the design of a system including MMIC chips working at these frequencies, it is proposed to use packages containing one or more chips, these packages making it possible to work at these frequencies and including two types of port: a port with transition by contactless electromagnetic coupling providing a connection with an antenna at the high working frequency F via a waveguide; and a port with microstrip or coaxial line type transition enabling a connection at a subharmonic frequency F/N (preferably N=6 or 4 or, if necessary, 3) of the working frequency.

Abstract: The invention relates to millimetric packaged electronic components for applications at high frequencies greater than 45 GHz. According to the invention, to facilitate the design of a system including MMIC chips working at these frequencies, it is proposed to use packages containing one or more chips, these packages making it possible to work at these frequencies and including two types of port: a port with transition by contactless electromagnetic coupling providing a connection with an antenna at the high working frequency F via a waveguide; and a port with microstrip or coaxial line type transition enabling a connection at a subharmonic frequency F/N (preferably N=6 or 4 or, if necessary, 3) of the working frequency.