Abstract: Keyboards include mechanisms that prevent and/or alleviate contaminant ingress. In some embodiments, a keyboard assembly includes a substrate, a key cap, a movement mechanism moveably coupling the key cap to the substrate, and a guard structure coupled to the key cap operable to direct contaminants away from the movement mechanism. In other embodiments, a keyboard includes a base; a web that defines apertures; keys moveably coupled to the base within the apertures; and a gasket coupled to the keys, the gasket fixed between the web and the base, operable to block passage of contaminants into the apertures.

Abstract: Keyboards include mechanisms that prevent and/or alleviate contaminant ingress. In some embodiments, a keyboard assembly includes a substrate, a key cap, a movement mechanism moveably coupling the key cap to the substrate, and a guard structure coupled to the key cap operable to direct contaminants away from the movement mechanism. In other embodiments, a keyboard includes a base; a web that defines apertures; keys moveably coupled to the base within the apertures; and a gasket coupled to the keys, the gasket fixed between the web and the base, operable to block passage of contaminants into the apertures.

Abstract: This disclosure provides systems, methods and apparatus for a ledge-free display. In one aspect, row driver circuits and column driver circuits may be provided from the backside of the display to reduce the size of the bezel around the display and eliminate the need for a bonding ledge for a ledge-free display.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device includes a movable element over the substrate and an actuation electrode. The movable element includes an electrically conductive deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The actuation electrode is under at least a portion of the deformable layer and is disposed laterally from the reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving towards the actuation electrode.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: This disclosure provides systems, methods and apparatus for forming raised anchor structures in a seal area. In one aspect, the anchor structures include a receiving space. Sealant can flow into the receiving spaces. In one aspect the receiving space is formed by an overhang section. In one aspect, the overhang can be formed in part by removing a sacrificial layer. The raised anchor structures in the seal area can improve adhesion between two plates by acting as mechanical hooks, further securing the plates together.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device includes a movable element over the substrate and an actuation electrode. The movable element includes an electrically conductive deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The actuation electrode is under at least a portion of the deformable layer and is disposed laterally from the reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving towards the actuation electrode.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.

Abstract: A microelectromechanical (MEMS) device includes a first reflective layer, a movable element, and an actuation electrode. The movable element is over the first reflective layer. The movable element includes a deformable layer and a reflective element. The actuation electrode is between the deformable layer and the reflective element.

Abstract: In certain embodiments, a microelectromechanical (MEMS) device comprises a substrate having a top surface, a movable element over the substrate, and an actuation electrode disposed laterally from the reflective surface. The movable element comprises a deformable layer and a reflective element mechanically coupled to the deformable layer. The reflective element includes a reflective surface. The movable element is responsive to a voltage difference applied between the actuation electrode and the movable element by moving in a direction generally perpendicular to the top surface of the substrate.

Abstract: A microelectromechanical (MEMS) device includes a substrate, a movable element over the substrate, and an actuation electrode above the movable element. The movable element includes a deformable layer and a reflective element. The deformable layer is spaced from the reflective element.

Abstract: A microelectromechanical (MEMS) device includes a first reflective layer, a movable element, and an actuation electrode. The movable element is over the first reflective layer. The movable element includes a deformable layer and a reflective element. The actuation electrode is between the deformable layer and the reflective element.

Abstract: The invention concerns a method for applying a surface modification agent composition for organosilicate glass dielectric films. More particularly, the invention pertains to a method for treating a silicate or organosilicate dielectric film on a substrate, which film either comprises silanol moieties or has had at least some previously present carbon containing moieties removed therefrom. The treatment adds carbon containing moieties to the film and/or seals surface pores of the film, when the film is porous.

Abstract: A toughening agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent selected from the group consisting of an amine, an onium compound and an alkali metal hydroxide.

Abstract: The present invention relates to semiconductor device fabrication and more specifically to a method and material for forming high density shallow trench isolation structures in integrated circuits capable of withstanding wet etch treatments. A silica dielectric film is formed on a substrate. The silica dielectric film has a density of from about 1.0 to about 2.3 g/ml, a SiC:SiO bond ratio of about 0.015 or more, a dielectric constant of about 4.0 or less, a breakdown voltage of about 2 MV/cm or more, and a wet etch resistance in a 100:1 by volume mixture of water and hydrogen fluoride of about 30 ?/minute or less.