Patents by Inventor Denis G. Roman

Denis G. Roman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7765673
    Abstract: A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.
    Type: Grant
    Filed: May 21, 2008
    Date of Patent: August 3, 2010
    Assignee: International Business Machines Corporation
    Inventors: Jean-Francois Fauh, Claude Gomez, Andre Lecerf, Denis G. Roman
  • Publication number: 20090044403
    Abstract: A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.
    Type: Application
    Filed: May 21, 2008
    Publication date: February 19, 2009
    Inventors: Jean-Francois Fauh, Clande Gomez, Andre Lecerf, Denis G. Roman
  • Patent number: 7391620
    Abstract: A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.
    Type: Grant
    Filed: December 17, 2003
    Date of Patent: June 24, 2008
    Assignee: International Business Machines Corporation
    Inventors: Jean-Francois Fauh, Claude Gomez, Andre Lecerf, Denis G. Roman
  • Patent number: 6884096
    Abstract: An apparatus for positioning an electronic printed circuit board within a electronic chassis is disclosed. The PCB includes at least one connector and the chassis backplane includes at least one connector adapted for electrically connecting to the PCB connector when the PCB is latched within the chassis. The apparatus comprises a lever and a rod. The lever includes a first pivot means that is rotated about the edge of the chassis. The lever is movable between a first position and a second position to allow the connector mounted on the back end of the PCB to engage the backplane connector by actuating the lever downward, or to disengage the PCB connector from the backplane connector by actuating the lever upward. The rod is pivotally coupled to the PCB by a rod pivot and pivotally coupled to the lever by a lever pivot that enables movement of the rod along the same plane in which the lever is actuated.
    Type: Grant
    Filed: December 10, 2003
    Date of Patent: April 26, 2005
    Assignee: International Business Machines Corporation
    Inventors: Bruno Centola, Denis G. Roman, Jean-Pierre Suzzoni
  • Publication number: 20040219811
    Abstract: An apparatus for positioning an electronic printed circuit board within a electronic chassis is disclosed. The PCB includes at least one connector and the chassis backplane includes at least one connector adapted for electrically connecting to the PCB connector when the PCB is latched within the chassis. The apparatus comprises a lever and a rod. The lever includes a first pivot means that is rotated about the edge of the chassis. The lever is movable between a first position and a second position to allow the connector mounted on the back end of the PCB to engage the backplane connector by actuating the lever downward, or to disengage the PCB connector from the backplane connector by actuating the lever upward. The rod is pivotally coupled to the PCB by a rod pivot and pivotally coupled to the lever by a lever pivot that enables movement of the rod along the same plane in which the lever is actuated.
    Type: Application
    Filed: December 10, 2003
    Publication date: November 4, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bruno Centola, Denis G. Roman, Jean-Pierre Suzzoni
  • Publication number: 20040207989
    Abstract: A method and system for improving power distribution and/or current measurement on a printed circuit board is disclosed. According to the invention, a first power plane adapted for current measurement includes a first segment to which a current source is connected and a second segment to which other devices may be connected, forming the current load. A third segment is used to measure the current between the first segment and the second segment through two vias that link two points of the third segment to, preferably, two pads of the external layer. In a preferred embodiment, vias are connected to the first segment so that current flow in the third segment is linear, to improve and simplify current determination. The resistivity between the pair of vias may be computed or estimated using calibrated currents.
    Type: Application
    Filed: December 17, 2003
    Publication date: October 21, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Jean-Francois Fauh, Claude Gomez, Andre Lecerf, Denis G. Roman