Abstract: Transmitter or receiver resonant circuit for carrying out contactless power transmission via resonant inductive coupling to a receiver or transmitter resonant circuit, comprising a first capacitance and a first winding, the first winding comprising an inductance and a first resistance, the transmitter resonant circuit comprising a second capacitance of value C2? and a second winding, the second winding comprising a second inductance of value L2? and a second resistance of value R2?, the transmitter resonant circuit having a natural angular frequency u>2 such that w2=1/V(L2?×C2?) and a natural frequency f2 such that f2=w2/(2?), characterized in that the value of the second inductance varies in a predetermined manner.

Abstract: An installation for manufacturing cross-linkable polyethylene compounds which comprises a melting machine (101), a melt pump (102) and a filtration unit (103) to produce cross-linkable polyethylene compounds that may be further used for manufacturing insulating parts of medium, high and extra-high voltage power cables, and a method for manufacturing such cross-linkable polyethylene compounds.

Abstract: An installation for manufacturing cross-linkable polyethylene compounds which comprises a melting machine (101), a melt pump (102) and a filtration unit (103) to produce cross-linkable polyethylene compounds that may be further used for manufacturing insulating parts of medium, high and extra-high voltage power cables, and a method for manufacturing such cross-linkable polyethylene compounds.

Abstract: Installation for manufacturing cross-linkable polyethylene compounds which comprises a melting machine (101), a melt pump (102) and a filtration unit (103). The installation allows to produce cross-linkable polyethylene compounds that may be further used for manufacturing insulating parts of medium, high and extra-high voltage power cables. A method for manufacturing cross-linkable polyethylene compounds is further provided.

Abstract: Installation for manufacturing cross-linkable polyethylene compounds which comprises a melting machine (101), a melt pump (102) and a filtration unit (103). The installation allows to produce cross-linkable polyethylene compounds that may be further used for manufacturing insulating parts of medium, high and extra-high voltage power cables. A method for manufacturing cross-linkable polyethylene compounds is further provided.

Abstract: A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.

Abstract: A method is provided for creating solder connections between two surfaces which connections are relatively weak and thus can be readily fractured for separating the surfaces. The preferred application of the disclosed process is its use in connecting semiconductor chips to a carrier in order to conduct burn-in tests on the chips. The process consists of a series of steps to form a surface having a matrix of solder wettable and solder non-wettable areas on the pads of the carrier. Once the solder balls on the chip are attached to the treated pads on the carrier, electrical contacts are made and the chip can be readily removed after the test. The uniquely configured carrier can then be reused numerous times for testing or burning-in chips.