Abstract: An electronic circuit board includes a printed circuit board and first and second electronic components. The printed circuit board includes a first insulating layer, a second insulating layer attached to the first insulating layer and in which is formed an open cavity, and a second conductive layer attached to the second insulating layer. The second conductive layer is treated to form a surface solder pad. The first electronic component is housed in the open cavity of the second insulating layer. The second electronic component is placed on the second insulating layer without overlapping with the open cavity. The first electronic component and the second electronic component each include a termination soldered on the surface solder pad, the surface solder pad being shared by the first and second electronic components.

Abstract: The invention relates to an electronic board comprising: —a printed circuit board (10) comprising a first insulating layer (11), a second insulating layer (13) attached to the first insulating layer (11) and in which a through cavity (5) is formed, and at least a second conductive layer attached to the second insulating layer (13), said second conductive layer being processed so as to form at least one surface solder pad (14, 16), and —at least one first electronic component (2) and at least one second electronic component (3), the first electronic component (2) being housed in the cavity (5) of the second insulating layer (13), the second electronic component (3) being placed on the second insulating layer (13), the first electronic component (2) and the second electronic component (3) each comprising a terminal (2a, 3a) soldered to the surface solder pad (14).

Abstract: The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).

Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).

Abstract: The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).

Abstract: The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).

Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).

Abstract: The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).