Patents by Inventor Denis LECORDIER

Denis LECORDIER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11770899
    Abstract: An electronic circuit board includes a printed circuit board and first and second electronic components. The printed circuit board includes a first insulating layer, a second insulating layer attached to the first insulating layer and in which is formed an open cavity, and a second conductive layer attached to the second insulating layer. The second conductive layer is treated to form a surface solder pad. The first electronic component is housed in the open cavity of the second insulating layer. The second electronic component is placed on the second insulating layer without overlapping with the open cavity. The first electronic component and the second electronic component each include a termination soldered on the surface solder pad, the surface solder pad being shared by the first and second electronic components.
    Type: Grant
    Filed: February 25, 2020
    Date of Patent: September 26, 2023
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Philippe Chocteau, Denis Lecordier
  • Publication number: 20220141959
    Abstract: The invention relates to an electronic board comprising: —a printed circuit board (10) comprising a first insulating layer (11), a second insulating layer (13) attached to the first insulating layer (11) and in which a through cavity (5) is formed, and at least a second conductive layer attached to the second insulating layer (13), said second conductive layer being processed so as to form at least one surface solder pad (14, 16), and —at least one first electronic component (2) and at least one second electronic component (3), the first electronic component (2) being housed in the cavity (5) of the second insulating layer (13), the second electronic component (3) being placed on the second insulating layer (13), the first electronic component (2) and the second electronic component (3) each comprising a terminal (2a, 3a) soldered to the surface solder pad (14).
    Type: Application
    Filed: February 25, 2020
    Publication date: May 5, 2022
    Applicant: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Philippe CHOCTEAU, Denis LECORDIER
  • Patent number: 11284519
    Abstract: The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 22, 2022
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Denis Lecordier, Philippe Chocteau
  • Patent number: 10959338
    Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: March 23, 2021
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Denis Lecordier, Philippe Chocteau, Jacky Jouan
  • Patent number: 10952314
    Abstract: The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: March 16, 2021
    Assignee: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Philippe Chocteau, Denis Lecordier
  • Publication number: 20200404777
    Abstract: The invention relates to an electronic board (1) comprising: —a printed circuit (2) having a connection face (3) defining a plane (X, Y) comprising at least one transfer area (4), —an electronic component (5) comprising at least one contact terminal (6), each contact terminal (6) being brazed or sintered on an associated transfer area (4) by means of a brazing joint or of a sintering joint (7), the electronic board being characterised in that an orthogonal projection of the contact terminal (6) of the electronic component (5) on the connection face (3) of the printed circuit does not overlap the associated area (4).
    Type: Application
    Filed: December 3, 2018
    Publication date: December 24, 2020
    Applicant: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Philippe CHOCTEAU, Denis LECORDIER
  • Publication number: 20200214142
    Abstract: The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: —applying an insulating layer (20) (S1) onto the printed circuit (10), —forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, —filling the cavity (22) with a solder paste (3), —positioning the SMD over the cavity (22) (S4), and —applying a heat treatment (S5) to the printed circuit (10).
    Type: Application
    Filed: July 13, 2018
    Publication date: July 2, 2020
    Applicant: SAFRAN ELECTRONICS & DEFENSE
    Inventors: Denis LECORDIER, Philippe CHOCTEAU, Jacky JOUAN
  • Publication number: 20200170121
    Abstract: The invention relates to a method for manufacturing (S) an electronic board (1) comprising the following steps: forming (S1, S4) a cavity (20) in the conductive skin layer (C1) and in an underlying insulating layer (10), so that at least part of a solder pad (4) is exposed, filling (S5) the cavity (20) with a solder paste (24), placing (S6) an SMD (3) opposite the cavity (20), soldering the SMD (3) on the electronic board (1).
    Type: Application
    Filed: July 13, 2018
    Publication date: May 28, 2020
    Inventors: Denis LECORDIER, Philippe CHOCTEAU