Patents by Inventor Denis Renaud

Denis Renaud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic device comprising light-emitting diodes
    Patent number: 11605759
    Abstract: An optoelectronic device including a substrate having opposite first and second surfaces; insulation trenches extending through the substrate, surrounding portions of the substrate and electrically insulating the portions from each other, each insulation trench being filled with at least one electrically insulating block and a gaseous volume or being filled with an electrically conductive element electrically isolated from the substrate; at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements; an electrode layer covering at least one of the light-emitting diodes and a conductive layer overlying the electrode layer around the light-emitting diodes; and a layer encapsulating the light-emitting diodes and covering the entire first surface.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: March 14, 2023
    Assignees: Aledia, Commissariat à l'Énergie Atomique et aux Énergies Alternatives
    Inventors: Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
  • Method for producing optoelectronic devices comprising light-emitting diodes
    Patent number: 11398579
    Abstract: A method for producing optoelectronic devices, including the following successive steps: providing a substrate having a first face; on the first face, forming sets of light-emitting diodes including wire-like, conical or frustoconical semiconductor elements; covering all of the first face with a layer encapsulating the light-emitting diodes; forming a conductive element that is insulated from the substrate and extends through the substrate from the second face to at least the first face; reducing the thickness of the substrate; and cutting the resulting structure in order to separate each set of light-emitting diodes.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: July 26, 2022
    Assignees: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Aledia
    Inventors: Christophe Bouvier, Emilie Pougeoise, Xavier Hugon, Carlo Cagli, Tiphaine Dupont, Philippe Gibert, Nacer Aitmani, Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
  • OPTOELECTRONIC DEVICE COMPRISING LIGHT-EMITTING DIODES
    Publication number: 20210257514
    Abstract: An optoelectronic device including a substrate having opposite first and second surfaces; insulation trenches extending through the substrate, surrounding portions of the substrate and electrically insulating the portions from each other, each insulation trench being filled with at least one electrically insulating block and a gaseous volume or being filled with an electrically conductive element electrically isolated from the substrate; at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements; an electrode layer covering at least one of the light-emitting diodes and a conductive layer overlying the electrode layer around the light-emitting diodes; and a layer encapsulating the light-emitting diodes and covering the entire first surface.
    Type: Application
    Filed: June 18, 2019
    Publication date: August 19, 2021
    Applicants: Aledia, Commissariat à I'Énergie Atomique et aux Énergies Alternatives
    Inventors: Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
  • METHOD FOR PRODUCING OPTOELECTRONIC DEVICES COMPRISING LIGHT-EMITTING DIODES
    Publication number: 20180301594
    Abstract: A method for producing optoelectronic devices, including the following successive steps: providing a substrate having a first face; on the first face, forming sets of light-emitting diodes including wire-like, conical or frustoconical semiconductor elements; covering all of the first face with a layer encapsulating the light-emitting diodes; forming a conductive element that is insulated from the substrate and extends through the substrate from the second face to at least the first face; reducing the thickness of the substrate; and cutting the resulting structure in order to separate each set of light-emitting diodes.
    Type: Application
    Filed: June 19, 2018
    Publication date: October 18, 2018
    Applicants: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, Aledia
    Inventors: Christophe Bouvier, Emilie Pougeoise, Xavier Hugon, Carolo Cagli, Tiphaine Dupont, Philippe Gibert, Nacer Aitmani, Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier