Abstract: An imprint (18) that represents a predefined pattern on an article. Article (10) comprises a body (12) made of a first material with a first thermal expansion coefficient (C1). The method comprises a step of incorporating a piece (22) in body (12) made of a second material with a second thermal expansion coefficient (C2), lower than the first coefficient, a step of heating article (10) to a predefined temperature to induce expansion of the materials, and then a step of cooling article (10) to induce shrinkage of the materials, generating a mechanicals stress that deforms article (10). Piece (22) is shaped so that the deformation generated corresponds to predefined pattern (20).

Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: The light-emitting diode is provided with a lid and is capable of emitting a first predefined color. The card further comprises a near field communications antenna circuit, the circuit and the diode being configured so that the diode emits light when a current of predefined intensity flows in the circuit. More particularly, the lid of the diode is coated with a mass of material forming means for selecting a set of wavelengths from those making up the first color so that the light transmitted through the mass has a second predefined color different from the first color.

Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Abstract: The electronic module (18) for an electronic device (10) such as a microcircuit card, comprises a substrate (20) delimiting first (20A) and second (20B) opposite faces. More particularly, the module (18) comprises a light source (26) borne by the second face (20B) of the substrate (20) and capable of illuminating a visible part of the electronic device.

Abstract: The microcircuit card (10) comprising a body (12) delimiting an edge (14) of the card (10). The body (12) incorporates a luminous means (16) capable of illuminating at least partially the edge (14) of the card (10).

Abstract: The smart card comprises a module having a microcircuit and a body including a cavity for receiving the module, wherein the cavity defines at least one surface area for fastening the module in the cavity, the body being formed by a stack of at least first and second layers respectively presenting weak adhesion and strong adhesion with the module. The area extends in the weak adhesion layer and includes at least one hole leading to the strong adhesion layer so as to form an anchor point for the module directly with said layer.

Abstract: The microcircuit card (10) comprising a body (12) delimiting an edge (14) of the card (10). The body (12) incorporates a luminous means (16) capable of illuminating at least partially the edge (14) of the card (10).

Abstract: The electronic module (18) for an electronic device (10) such as a microcircuit card, comprises a substrate (20) delimiting first (20A) and second (20B) opposite faces. More particularly, the module (18) comprises a light source (26) borne by the second face (20B) of the substrate (20) and capable of illuminating a visible part of the electronic device.

Abstract: An imprint (18) that represents a predefined pattern on an article. Article (10) comprises a body (12) made of a first material with a first thermal expansion coefficient (C1). The method comprises a step of incorporating a piece (22) in body (12) made of a second material with a second thermal expansion coefficient (C2), lower than the first coefficient, a step of heating article (10) to a predefined temperature to induce expansion of the materials, and then a step of cooling article (10) to induce shrinkage of the materials, generating a mechanicals stress that deforms article (10). Piece (22) is shaped so that the deformation generated corresponds to predefined pattern (20).

Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.

Abstract: The light-emitting diode is provided with a lid and is capable of emitting a first predefined color. The card further comprises a near field communications antenna circuit, the circuit and the diode being configured so that the diode emits light when a current of predefined intensity flows in the circuit. More particularly, the lid of the diode is coated with a mass of material forming means for selecting a set of wavelengths from those making up the first color so that the light transmitted through the mass has a second predefined color different from the first color.

Abstract: The invention concerns the personalisation graphics of identification documents. The identification document comprises a body where at least one of the main surfaces forms a print surface, on which artwork (14A, 14B) and/or personalised information (24A, 24B) are printed, the said print surface being covered with reinforced protective film (31A, 31B). The identification document further comprises a protective overlay (25A, 25B) transferred to the print surface with an ink ribbon, the said protective overlay being capable of enabling the adherence of the said reinforced protective film (31A, 31B) on the ink transferred to the said print surface.

Abstract: The invention involves a card, including a card body including at least three laminated plastic layers directly superimposed on each other, a second layer being a layer in polyethylene terephthalate glycol placed between a first layer and a third layer, the first layer and third layer being of a chemical nature different from that of said second layer, and an electronic module being incorporated in a cavity of the card body, the module including an integrated circuit, where the thickness of the second layer is of the same order of magnitude as that of the first and third layers, and wherein the cavity extends into the second layer from the first layer.

Abstract: A method of making an electronic component, in particular a contactless card which includes an antenna. The card has an insulating substrate provided with conductive tracks, and a semiconductor chip mounted on the substrate. Conductive tracks are formed on the substrate by screen printing using a conductive ink. A semiconductor chip as provided with contact areas is supplied, and conductive terminals, or “bumps”, are formed on at least some of the contact areas. The chip is disposed on the substrate, before the conductive ink is dry, so that the ends of the bumps penetrate into the ink at the corresponding locations. The chip is fixed mechanically to the substrate by polymerizing an insulating adhesive resin disposed between the bottom face of the chip and the top face of the substrate.