Abstract: A three-dimensional (3D) forensic evidence system is provided. The system includes a noncontact measurement device operable to measure a distance from the device to a surface. A first camera is operably coupled to the noncontact measurement device, the first camera having a field of view. A light source is operably coupled to the first camera and operable to emit light onto the surface within the field of view. A processor operably is coupled to the first camera, the processor operable to execute computer instructions when executed on the processor for determining 3D coordinates of at least one point in the field of view based at least in part on the distance, and assigning at least one color value to the at least one point in response to determining an interaction of a predefined wavelength of light with a substance in the field of view.

Abstract: A three-dimensional measuring system includes a body, an internal projector attached to the body, and a dichroic camera assembly, the dichroic camera assembly including a first beam splitter that directs a first portion of incoming light into a first channel leading to a first photosensitive array and a second portion of the incoming light into a second channel leading to a second photosensitive array.

Abstract: A three-dimensional (3D) coordinate measuring system includes an external projector that projects a pattern of light onto an object and an aerial drone attached to a 3D imaging device, the 3D imaging device and the external projector cooperating to obtain 3D coordinates of the object.

Abstract: The invention relates to a method for producing an active optical connection with an optoelectronic element and a light deflection means for light deflection between the optoelectronic element and an optical waveguide arranged transversely with respect to the beam direction of said element. In this case, it is provided that a carrier substrate for the optoelectronic element is arranged in a highly precisely repeatably positioning machine, in particular a flip-chip machine, the optoelectronic element is mounted on the substrate by a or the highly precisely repeatably positioning machine and a curable, moldable compound is applied over the optoelectronic element, and the moldable compound is molded by a mold for molding light deflection means, said mold being moved by a or the highly precisely repeatably positioning machine, and at the earliest thereafter the substrate is removed from the or a highly precisely repeatably positioning machine.

Abstract: The invention relates to a method for producing an active optical connection with an optoelectronic element and a light deflection means for light deflection between the optoelectronic element and an optical waveguide arranged transversely with respect to the beam direction of said element. In this case, it is provided that a carrier substrate for the optoelectronic element is arranged in a highly precisely repeatably positioning machine, in particular a flip-chip machine, the optoelectronic element is mounted on the substrate by a or the highly precisely repeatably positioning machine and a curable, moldable compound is applied over the optoelectronic element, and the moldable compound is molded by a mold for molding light deflection means, said mold being moved by a or the highly precisely repeatably positioning machine, and at the earliest thereafter the substrate is removed from the or a highly precisely repeatably positioning machine.