Patents by Inventor Denise Reichel

Denise Reichel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for determining the temperature of a substrate
    Patent number: 9612158
    Abstract: An apparatus for determining the temperature of a substrate, in particular of a semiconductor wafer during a heating thereof by means of a first radiation source is described. Furthermore, an apparatus and a method for thermally treating substrates are described, in which the substrate is heated by means of at least one first radiation source. The apparatus comprises a first grating structure having grating lines, which are opaque with respect to a substantial portion of the radiation of the first radiation source, wherein the grating structure is arranged between the first radiation source and the substrate, and a drive unit for moving the first grating structure.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: April 4, 2017
    Assignee: Centrotherm Thermal Solutions GmbH & Co. KG
    Inventors: Denise Reichel, Wilfried Lerch, Jeff Gelpey, Wolfgang Skorupa, Thomas Schumann
  • DEVICE FOR DETERMINING THE TEMPERATURE OF A SUBSTRATE
    Publication number: 20140248720
    Abstract: An apparatus for determining the temperature of a substrate, in particular of a semiconductor wafer during a heating thereof by means of a first radiation source is described. Furthermore, an apparatus and a method for thermally treating substrates are described, in which the substrate is heated by means of at least one first radiation source. The apparatus comprises a first grating structure having grating lines, which are opaque with respect to a substantial portion of the radiation of the first radiation source, wherein the grating structure is arranged between the first radiation source and the substrate, and a drive unit for moving the first grating structure.
    Type: Application
    Filed: October 17, 2012
    Publication date: September 4, 2014
    Applicant: CENTROTHERM THERMAL SOLUTIONS GMBH &CO. KG
    Inventors: Denise Reichel, Wilfried Lerch, Jeff Gelpey, Wolfgang Skorupa, Thomas Schumann