Patents by Inventor Dennis A. Canfield

Dennis A. Canfield has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conditioning of a substrate for electroless plating thereon
    Patent number: 5318803
    Abstract: A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.
    Type: Grant
    Filed: November 13, 1990
    Date of Patent: June 7, 1994
    Assignee: International Business Machines Corporation
    Inventors: Harry R. Bickford, Dennis A. Canfield, Arthur E. Graham, Stephen L. Tisdale, Alfred Viehbeck
  • Encapsulated circuitized power core alignment and lamination
    Patent number: 5229550
    Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
    Type: Grant
    Filed: March 31, 1992
    Date of Patent: July 20, 1993
    Assignee: International Business Machines Corporation
    Inventors: Perminder S. Bindra, Dennis A. Canfield, Voya Rista Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas
  • Encapsulated circuitized power core alignment and lamination
    Patent number: 5129142
    Abstract: A structure and method are disclosed for making high density circuit board. Using photosensitive or other dielectric materials over a circuitized power core, vias and lands are opened up, filled with joining metal and aligned with the next level, eliminating a major registration problem in building up a high density composite and reducing the number of steps in the manufacturing process.
    Type: Grant
    Filed: October 30, 1990
    Date of Patent: July 14, 1992
    Assignee: International Business Machines Corporation
    Inventors: Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas