Patents by Inventor Dennis A. Schmidt
Dennis A. Schmidt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10351280Abstract: A and device method for handling containers, in particular cardboard boxes, for groups of objects, in particular packages, in which the objects are inserted one after another into the container and are deposited there in an ordered formation, and in which the containers are held ready in each case by a handling device, in particular a cardboard box robot, for the insertion of the objects, and in each case several containers are held ready at the same time by the handling device so that they can be filled with objects.Type: GrantFiled: April 29, 2014Date of Patent: July 16, 2019Assignee: Focke & Co. (GmbH & Co. KG)Inventors: Andreas Prahm, Dennis Schmidt
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Publication number: 20160083129Abstract: A and device method for handling containers, in particular cardboard boxes, for groups of objects, in particular packages, in which the objects are inserted one after another into the container and are deposited there in an ordered formation, and in which the containers are held ready in each case by a handling device, in particular a cardboard box robot, for the insertion of the objects, and in each case several containers are held ready at the same time by the handling device so that they can be filled with objects.Type: ApplicationFiled: April 29, 2014Publication date: March 24, 2016Applicant: FOCKE & CO. (GMBH CO. KG)Inventors: Andreas Prahm, Dennis Schmidt
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Publication number: 20070084214Abstract: A start system for a gas turbine engine delivers starter current according to a schedule selected according to measured rotational speed and oil temperature of the gas turbine engine.Type: ApplicationFiled: October 19, 2005Publication date: April 19, 2007Inventors: Dennis Schmidt, David Ripley, Lawrence Cogsdill
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Publication number: 20070027655Abstract: A condition monitoring system for an aeronautical power system with an electronic data collection system that lets components of the aeronautical power system identify themselves over a single wire data bus and transfers identification data received over the single wire data bus to a health monitoring system for analysis of the aeronautical system components.Type: ApplicationFiled: July 26, 2005Publication date: February 1, 2007Inventor: Dennis Schmidt
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Patent number: 6696651Abstract: A lockout for circuit breakers provides a channel holding the circuit breaker toggle bar with a set screw that may be accessed only when an eye of the lockout is free of a padlock shackle. The eye is oriented vertically so that the padlock may be rotated to not interfere with adjacent circuit breakers being locked out or operated.Type: GrantFiled: September 30, 2002Date of Patent: February 24, 2004Assignee: Rockwell Automation Technologies, Inc.Inventors: David Koopmeiners, Dennis Drake, Dennis Schmidt
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Patent number: 6333546Abstract: An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.Type: GrantFiled: October 20, 2000Date of Patent: December 25, 2001Assignee: International Business Machines CorporationInventors: Patricia Marmillion, Anthony M. Palagonia, Dennis A. Schmidt
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Patent number: 6294453Abstract: An electrically activated fuse with a high melting point heater element in series with a low melting point fusible link. The heater element has a higher resistivity and larger cross-sectional area than the fusible link in order to withstand heat that the heater element generates bringing the fusible link to its melting point. Fuse dimensions (width and length) are each between 0.1 and 2.0 microns, with a thermal mass of the heater element being sufficient to melt the fusible link.Type: GrantFiled: May 7, 1998Date of Patent: September 25, 2001Assignee: International Business Machines Corp.Inventors: Patricia E. Marmillion, Anthony M. Palagonia, Dennis A. Schmidt
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Patent number: 6246583Abstract: An apparatus and method are provided that remove sufficient heat from both SOI and non-SOI semiconductor devices to prevent the devices from overheating during operation. A plurality of thermally conductive pads such as electrically conductive studs are coupled to a first side of a semiconductor device having circuit elements formed thereon. The thermally conductive pads also are coupled to a substrate comprising an apparatus for extracting heat from the thermally conductive pads. The apparatus for extracting heat from the thermally conductive pads preferably comprises one or more metallic planes. A module cover having a thermally conductive path formed therein also may be coupled between the apparatus for extracting heat and a heat sink to further aid in heat removal from the semiconductor device. Thermally conductive pads may be coupled between the semiconductor device and I/O pins of the substrate to improve heat dissipation via the I/O pins.Type: GrantFiled: March 4, 1999Date of Patent: June 12, 2001Assignee: International Business Machines CorporationInventors: John E. Cronin, Janak G. Patel, Dennis A. Schmidt
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Patent number: 6190836Abstract: A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain.Type: GrantFiled: April 28, 2000Date of Patent: February 20, 2001Assignee: International Business Machines CorporationInventors: Brian J. Grenon, Richard A. Haight, Dennis M. Hayden, Michael S. Hibbs, J. Peter Levin, Timothy E. Neary, Raymond E. Rochefort, Dennis A. Schmidt, Jacek G. Smolinski, Alfred Wagner
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Patent number: 6165649Abstract: A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain.Type: GrantFiled: January 21, 1997Date of Patent: December 26, 2000Assignee: International Business Machines CorporationInventors: Brian J. Grenon, Richard A. Haight, Dennis M. Hayden, Michael S. Hibbs, J. Peter Levin, Timothy E. Neary, Raymond E. Rochefort, Dennis A. Schmidt, Jacek G. Smolinski, Alfred Wagner
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Patent number: 6156461Abstract: A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain.Type: GrantFiled: February 14, 2000Date of Patent: December 5, 2000Assignee: International Business Machines CorporationInventors: Brian J. Grenon, Richard A. Haight, Dennis M. Hayden, Michael S. Hibbs, J. Peter Levin, Timothy E. Neary, Raymond E. Rochefort, Dennis A. Schmidt, Jacek G. Smolinski, Alfred Wagner
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Patent number: 6090507Abstract: A method of repairing defects on masks includes the step of providing a coating on the mask to prevent damage to clear regions of the mask from laser ablation splatter, laser ablation caused quartz pitting, laser deposition staining, and FIB caused gallium staining. The coating is a metal, a polymer, or a carbon material. The coating is formed on clear regions of the mask as well as either over or under the light absorbing material of the mask. A coating comprising a thin copper layer significantly improves imaging with the ion beam while protecting clear regions of the mask from FIB stain. A coating formed of a photosensitive polymer is used to etch opaque defects. While wanted opaque regions adjacent an opaque defect are also etched in this etch step, these created clear defects are then repaired in a subsequent FIB deposition step while a copper coating protects adjacent clear regions from FIB stain.Type: GrantFiled: March 3, 1999Date of Patent: July 18, 2000Assignee: International Business Machines CorporationInventors: Brian J. Grenon, Richard A. Haight, Dennis M. Hayden, Michael S. Hibbs, J. Peter Levin, Timothy E. Neary, Raymond E. Rochefort, Dennis A. Schmidt, Jacek G. Smolinski, Alfred Wagner
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Patent number: 5872025Abstract: Stacked three-dimensional devices can be prepared by stacking wafers as an alternative to stacking individual devices. Chip regions are formed on several wafers with each chip region being surrounded by a separation region, such as an insulator filled trench. The wafers are then stacked with the chip regions in alignment. Aligning the wafers can be facilitated using notched regions in the periphery of the wafers. The wafers are then joined together by lamination. After laminating the stacks of wafers, stacks of chips are separated by etching, dicing or other processes, which separate out stacked chip devices from the stacked wafer at the chip separation regions. The process allows several stacked chip devices to be manufactured simultaneously.Type: GrantFiled: March 11, 1997Date of Patent: February 16, 1999Assignee: International Business Machines CorporationInventors: John E. Cronin, Anthony Palagonia, Bernadette A. Pierson, Dennis A. Schmidt
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Patent number: 4386729Abstract: An octagonal container having a unique bottom closure and a blank therefor are provided. The body of the octagonal container includes a pair of major wall panels, a pair of minor wall panels, and four corner wall panels. Each major and minor wall panel is foldably connected to a corner wall panel on either side. In the preferred embodiment, one of the minor wall panels is formed from two pieces, which are secured in overlapping relation to one another. The closure section includes a pair of rectangular major cover flaps, a pair of rectangular minor cover flaps, and four polygonal corner flaps. Each major cover flap is foldably connected to a major wall panel. Each corner flap is foldably connected to a corner wall panel. Each minor cover flap is foldably connected to a minor wall panel. In the preferred embodiment, one of the minor cover flaps is formed from two pieces, which are fastened in overlapping relation to one another.Type: GrantFiled: March 23, 1981Date of Patent: June 7, 1983Assignee: International Paper CompanyInventor: Dennis A. Schmidt
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Patent number: D857749Type: GrantFiled: December 1, 2017Date of Patent: August 27, 2019Assignee: AGCO CorporationInventors: Jarret Lee Brinker, Michael Dennis Schmidt
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Patent number: D858574Type: GrantFiled: December 1, 2017Date of Patent: September 3, 2019Assignee: AGCO CorporationInventors: Jarret Lee Brinker, Michael Dennis Schmidt
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Patent number: D877169Type: GrantFiled: December 1, 2017Date of Patent: March 3, 2020Assignee: AGCO CorporationInventors: Jarret Lee Brinker, Michael Dennis Schmidt
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Patent number: D887447Type: GrantFiled: May 24, 2019Date of Patent: June 16, 2020Assignee: AGCO CorporationInventors: Jarret Lee Brinker, Michael Dennis Schmidt