Abstract: A jig for aligning a wafer-handling system in a calibration location, such as a wafer pickup-dismount location, with respect to a wafer-processing tool. The jig comprises an alignment fixture adapted to be repeatably mounted on the tool and having one or more edge stops. The jig may further comprise an edge-to-center locator adapted to be mounted on the alignment fixture. The edge-to-center locator has a peripheral edge and a center marker that identifies the precise center of the calibration location when the edge-to-center locator edge is positioned in contact with the edge stop or stops. An alignment method for use of the jig is also disclosed.

Abstract: A calibration wafer for precisely aligning a wafer-handling system that processes a plurality of product wafers. The calibration wafer has radial and thickness dimensions and tolerances equivalent to those of the product wafers and further comprises a first center marker adapted for alignment with a second center marker external to the calibration wafer. The calibration wafer may be a component of a wafer center alignment device for precisely aligning a wafer-handling system in a calibration location in relation to a wafer-processing tool, the device further comprising an alignment jig adapted to be repeatably mounted on the tool and on which the second center marker is located. The calibration wafer is adapted to be positioned so that the first center marker aligns with the second center marker.