Abstract: The present invention relates to adhesives which contain a polyester polyol on the basis of furandicarboxylic acid obtained from renewable raw materials, and to a method for bonding substrates, in particular film-like substrates, using said adhesive.

Abstract: The invention relates to a 2-component polyurethane adhesive, in particular for laminating films, wherein the PU adhesive, based on the total weight of the laminating adhesive composition, (a) contains as resin component at least one NCO-terminated polyurethane pre-polymer having a content of at least 40% by weight of diphenylmethandiisocyanate (MDI), wherein the MDI is 4,4?-diphenylmethandiisocyanate or a mixture thereof with 2,4?-diphenylmethandiisocyanate, and (b) contains as hardener component a polyol mixture comprising at least three different polyols. The invention further relates to the use of the adhesive for adhesively bonding films, to methods for producing composite films, and to composite films bonded by means of the described adhesive.

Abstract: The invention relates to a two-component polyurethane adhesive, in particular for laminating films, wherein the PU adhesive, based on the total weight of the laminating adhesive composition, (a) contains as resin component at least one NCO-terminated polyurethane pre-polymer having a content, based on the total weight of the resin component, of at least 40 wt % of diphenylmethanedi-isocyanate (MDI), wherein the MDI is 4,4?-diphenylmethanediisocyanate or a mixture thereof with 2,4?-diphenylmethanediisocyanate, and 2 to 20 wt % of polyglycol having a molecular weight Mw of 200 to <1000 g per mol, and (b) contains as hardener component a polyol mixture comprising 2, 3, or more different polyols and is free of polyesters. The invention further relates to the use of the adhesive for bonding films, to methods for producing composite films, and to composite films bonded with the adhesive described.

Abstract: A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO—((CH2)m—O)n—X wherein m=2, 3 or 4; n=2 to 50; X=H, linear, branched or aromatic C1 to C12-alkyl, the ester having a molecular weight from 150 to 2000 g/mol; (ii) non-reactive (co)polymer(s) based on unsaturated monomers, wherein said unsaturated monomers are selected from vinyl esters, (meth)acrylate esters and C2 to C8 unsaturated olefins, the (co)polymer having a molecular weight from 5000 g/mol to 500000 g/mol, such adhesive can form a solid adhesive layer after being cross-linked by radiation, the layer, has a non tacky surface but can be adhesively bonded under pressure to a second layer of the adhesive.

Abstract: The present invention relates to a polyurethane adhesive, in particular for laminating multilayer films, wherein the PU adhesive contains—based on the total weight of the adhesive—5 to 50 wt %, preferably 10 to 40 wt %, particularly preferably 20 to 30 wt % of at least one solid particulate filler, wherein at least 90% of the filler particles of the at least one filler has a particle size of 4 ?m or less, and the at least one filler has a Mohs hardness of 3 or less. The present invention also relates to the use of the adhesive for adhering films, to methods for producing composite films, and to composite films adhered using the aforementioned adhesive.

Abstract: Adhesive for adhering synthetic and/or metal substrates, selected from liquid or thermoplastic adhesives which have urethane groups in the polymer chain, wherein the adhesive is selected from NCO-reactive adhesives, silane-reactive adhesives or thermoplastic polyurethanes (TPU) and include as a constituent 0.01 to 10 wt. % of at least one compound (H) having a molecular weight of less than 500 g/mol, which compound has at least one sulphonamide group having an SO2—NH—C(O) structure or at least one amidosulphonate group.

Abstract: Adhesive for adhering synthetic and/or metal substrates, selected from liquid or thermoplastic adhesives which have urethane groups in the polymer chain, wherein the adhesive is selected from NCO-reactive adhesives, silane-reactive adhesives or thermoplastic polyurethanes (TPU) and include as a constituent 0.01 to 10 wt. % of at least one compound (H) having a molecular weight of less than 500 g/mol, which compound has at least one sulphonamide group having an SO2—NH—C(O) structure or at least one amidosulphonate group.

Abstract: A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO—((CH2)m—O)n—X wherein m=2, 3 or 4; n=2 to 50; X=H, linear, branched or aromatic C1 to C12-alkyl, the ester having a molecular weight from 150 to 2000 g/mol; (ii) non-reactive (co)polymer(s) based on unsaturated monomers, wherein said unsaturated monomers are selected from vinyl esters, (meth)acrylate esters and C2 to C8 unsaturated olefins, the (co)polymer having a molecular weight from 5000 g/mol to 500000 g/mol, such adhesive can form a solid adhesive layer after being cross-linked by radiation, the layer has a non tacky surface but can be adhesively bonded under pressure to a second layer of the adhesive.

Abstract: A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate.

Abstract: A process of bonding a metal substrate to a non-halogenated polymer, especially of bonding a polyolefin overcoat to a metallic tube or pipe, using an epoxy-based adhesive which comprises at least one salt of a metal ion M in an oxidation state of n which has a standard reduction potential E0M more positive than the standard reduction potential of the surface of the metal substrate; an object comprising a metal substrate and a non-halogenated polymer bonded together by this process; a tube or pipe made of a metal substrate onto which a layer of a non-halogenated polymer is bonded by a cured epoxy-based adhesive.