Abstract: A microelectronic assembly (10) is formed by attaching a component subassembly (34) to a substrate (12). The substrate (12) includes a face (26) and defines a via (28) having a via opening (30) at the face (26). The substrate (12) further defines a component cavity (32) at the face (26). An electrical element (14) is disposed within the substrate (12) and includes a terminal (24) at the via (28). The component subassembly (34) is formed by mounting an integrated circuit component (16) onto a metallic lead (18). The integrated circuit component (16) is electrically connected to the metallic lead (18) by a wire lead (36). A leg (20) is formed by deforming a portion of the metallic lead (18). A polymeric body (56) is formed about the component (16) and wire leads (36). The component subassembly (34) is superposed onto the substrate (12), and the component (16) is received in the component cavity (32). The metallic lead (18) is affixed to the face (26).

Abstract: A microelectronic assembly (10) is formed by bonding an integrated circuit component (20) to a substrate (12). The substrate (12) includes a via (22) and a metal contact (24) closing the via (22). A bonding agent (14), such as a solder paste or a conductive epoxy, is dispensed into the via (22) adjacent the metal contact (24). A carrier tape (16) that includes partially-cured films (18) is placed onto the substrate (12) such that the film (18) covers the via (22) and forms a gap (28) between the substrate (12) and the film (18). The integrated circuit component (20) is superposed onto the substrate (12) such that conductive bumps (26) on the integrated circuit component (20) perforate and extend through the film (18) and contact the bonding agent (14) in the via (22). Portions (44) displaced during perforation are received in the gap (28). The film (18) is thus interposed between the substrate (12) and the integrated circuit component (20).

Abstract: Solder paste (16) is dispensed onto a platen (12) that includes depressions (14) that are preferably conical or in an inverted pyramid shape. The solder paste (16) is formed of a plurality of particles composed of a solder alloy. Excess solder paste (16) is removed, and a predetermined solder paste volume fills the depressions (14). A substrate (18) is superposed onto platen (12) such that solder-wettable bond pads (20) on the substrate (18) register with the depressions (14). The platen (12) is heated to melt the solder alloy, and the solder alloy coalesces to form molten solder droplets (22). The solder droplets (22) are transferred onto the solder-wettable bond pads (20) to form solder bumps (24) bonded to the bond pads (20).

Abstract: A vacuum pickup tool (10) is effective to carry balls (18) arranged in a desired pattern. The vacuum pickup tool (10) includes a manifold (12) that includes a carrier plate (22) that has a plurality of manifold bores (28) arranged in a pattern. The manifold (12) defines a vacuum chamber (20) that reduces gas pressure in the manifold (12) to allow the manifold bores (28) to retain a ball (18). The manifold (12) further includes a retaining plate (14) that overlies the carrier plate (22) and includes a plurality of retaining plate bores (30) arranged in a pattern such that each retaining plate bore (30) registers with a corresponding manifold bore (28). The retaining plate (14) is effective to secure a stencil (16) formed of a gas-impermeable sheet against the carrier plate (22) to prevent gas flow between a manifold bore (28) and a corresponding retaining plate bore (30).

Abstract: The invention is concerned with compositions comprising novel water-dispersible copolymers which contain at least one UVA light-absorbing monomer, one UVB light-absorbing monomer, one hydrophilic monomer, and optionally one hydrophobic monomer component. The UVA light-absorbing monomer absorbs at .lambda.max ultraviolet light in the 320-400 nm range. The UVB light-absorbing monomer absorbs at .lambda.max ultraviolet light in the 290-320 nm range. Because of the R.sub.3 group used in the invention, the copolymers used in the compositions of the invention permit higher loading of UV monomers than previously obtainable.

Abstract: Compositions containing hydroxy acids and/or retinoids and further containing borage seed oil as an anti-irritant. Borage seed oil was found to be uniquely effective (when compared to gamma-linolenic acid, or other anti-irritants containing gamma-linolenic acid or other known anti-irritants) in reducing the irritation caused by hydroxy acids and/or retinoids.