Abstract: The present invention provides, in one embodiment, a P-type Metal Oxide Semiconductor (PMOS) device (100). The device (100) comprises a tensile-strained silicon layer (105) located on a silicon-germanium substrate (110) and silicon-germanium source/drain structures (135, 140) located on or in the tensile-strained silicon layer (105). The PMOS device (100) further includes a channel region (130) located between the silicon-germanium source/drain structures (135, 140) and within the tensile-strained silicon layer (105). The channel region (130) has a compressive stress (145) in a direction parallel to an intended current flow (125) through the channel region (130). Other embodiments of the present invention include a method of manufacturing the PMOS device (200) and a MOS device (300).

Abstract: The present invention provides, in one embodiment, a P-type Metal Oxide Semiconductor (PMOS) device (100). The device (100) comprises a tensile-strained silicon layer (105) located on a silicon-germanium substrate (110) and silicon-germanium source/drain structures (135, 140) located on or in the tensile-strained silicon layer (105). The PMOS device (100) further includes a channel region (130) located between the silicon-germanium source/drain structures (135, 140) and within the tensile-strained silicon layer (105). The channel region (130) has a compressive stress (145) in a direction parallel to an intended current flow (125) through the channel region (130). Other embodiments of the present invention include a method of manufacturing the PMOS device (200) and a MOS device (300).

Abstract: A die (20) particularly adapted for making a screw blank having a reduced diameter, offset or asymmetric section has a first die section (30) having a central bore (32), which mates with a second die section (50) having a smaller diameter and/or offset bore (52). A shaped end (57) of the smaller or offset bore (52), which forms the reduced diameter, offset or asymmetric section of a screw blank, is coated with a hard lubricating material. The method of manufacturing the die (20) involves making two first die sections (30), which are preferably identical, from a first die body (130), and two second die sections (50), which are also preferably identical and adapted to mate with the first die section (30), from a second die body (150).