Abstract: An integrated circuit device having a multi-layer substrate coupled to receive an integrated circuit die and enabling fixed voltage reference signals of a power distribution network and input/output signals to be routed in the integrated circuit device. The multi-layer substrate comprises a first metal layer comprising a reference signal plane of coupling a first fixed voltage reference signal; a dielectric layer positioned on the first metal layer; and a second metal layer having a plurality of conductive traces, wherein the plurality of conductive traces comprise conductive traces for coupling a second fixed reference signal and input/output signals. The plurality of conductive traces may be in a predetermined pattern having reference signal traces and input/output signal traces. A method of enabling different signals comprising reference signals and input/output signals to be routed in a multi-layer substrate adapted to receive a die in an integrated circuit is also disclosed.