Patents by Inventor Dennis Cadiz YBORDE

Dennis Cadiz YBORDE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
    Publication number: 20230246364
    Abstract: A system for attaching a terminal pin to a circuit trace on an electronic substrate. The system includes a sonotrode and a stage for holding the electronic substrate. The sonotrode is configured to direct ultrasound energy to a base region of the terminal pin placed on the circuit trace to weld the base region to the circuit trace. The system further includes a three-dimensional positioner coupled to the sonotrode. The three-dimensional positioner is configured to drive the sonotrode to lift the terminal pin from a rack and to place the terminal pin on the electronic substrate.
    Type: Application
    Filed: April 10, 2023
    Publication date: August 3, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino Mercado TOLENTINO, Dennis Cadiz YBORDE, Shutesh KRISHNAN, Pui Leng LOW
  • Bonding module pins to an electronic substrate
    Patent number: 11626677
    Abstract: A method includes disposing a terminal pin on an electronic substrate with a base region of the terminal pin in contact with a circuit trace on an electronic substrate, and ultrasonically coupling the base region of the terminal pin to the circuit trace.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: April 11, 2023
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino Mercado Tolentino, Dennis Cadiz Yborde, Shutesh Krishnan, Pui Leng Low
  • BONDING MODULE PINS TO AN ELECTRONIC SUBSTRATE
    Publication number: 20210359445
    Abstract: A method includes disposing a terminal pin on an electronic substrate with a base region of the terminal pin in contact with a circuit trace on an electronic substrate, and ultrasonically coupling the base region of the terminal pin to the circuit trace.
    Type: Application
    Filed: May 13, 2020
    Publication date: November 18, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Erik Nino Mercado TOLENTINO, Dennis Cadiz YBORDE, Shutesh KRISHNAN, Pui Leng LOW