Abstract: A die bonding system uses an inert gas chamber having a bottom aperture through which a heater assembly can insert a part for bonding, a cover having a top aperture through which a die bond head can insert and bond a die to the part, and a plurality of apertures through a base of the inert gas chamber through which a forming gas is bled through to evacuate the chamber of oxygen before performing a die bonding operation, reducing the potential for oxidation while maintaining cycle times suitable for use in a production environment.

Abstract: A dispensing apparatus has a motor drive that moves an output member along an axis in a first chamber. A shuttle valve controls flow between a first chamber and either a reservoir of material or an output port. Extending the output member discharges precise volumes of material through an output port. Retracting the output member fills the first chamber.

Abstract: A flip chip assembly machine (FCAM) (30) includes a main gantry (50) and a substrate camera gantry (40) that are configured to operate independently of each other and, respectively, support a die (12) and a substrate camera (38) for alignment purposes. The FCAM further includes a fluxer (130) for applying flux to the die. A flip-to-flux pick and place subassembly (116) picks up a die and places it in flux (46) independently of the operation of the main gantry, which may perform another task during the flux dwell time. A substrate carrier conveyor (154) includes a walking beam (260) to rapidly accelerate and decelerate substrate carrier movement into and out of the FCAM.