Patents by Inventor Dennis Cong

Dennis Cong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for enhancing the adhesion of copper deposited by chemical vapor deposition
    Publication number: 20020119657
    Abstract: The present invention provides a method for improving the adhesion of copper and other metal-comprising conductive metals to a barrier layer. A barrier is provided that has a first surface that is substantially unoxidized, wherein at least a portion of the surface is free from the presence of oxygen atoms. A conductive layer is then deposited onto the first surface of the barrier layer. The substantially unoxidized state of the first surface enhances the adhesion of the metal-comprising layer to the barrier layer. The method is particularly useful in obtaining excellent adhesion of a copper nucleation layer to an underlying barrier layer surface.
    Type: Application
    Filed: December 17, 2001
    Publication date: August 29, 2002
    Inventors: Srinivas Gandikota, Dennis Cong, Liang Chen, Sesh Ramaswami, Daniel Carl
  • Method for enhancing the adhesion of copper deposited by chemical vapor deposition
    Patent number: 6362099
    Abstract: The present invention provides a method for improving the adhesion of copper and other metal-comprising conductive metals to a barrier layer. A barrier layer is provided that has a first surface that is substantially unoxidized, wherein at least a portion of the first surface is free from the presence of oxygen atoms. A conductive layer is then deposited onto the first surface of the barrier layer. The substantially unoxidized state of the first surface enhances the adhesion of the metal-comprising layer to the barrier layer. The method is particularly useful in obtaining excellent adhesion of a copper nucleation layer to an underlying barrier layer surface.
    Type: Grant
    Filed: March 9, 1999
    Date of Patent: March 26, 2002
    Assignee: Applied Materials, Inc.
    Inventors: Srinivas Gandikota, Dennis Cong, Liang Chen, Sesh Ramaswami, Daniel Carl