Abstract: A process for the formation of an article having multiple electrical circuits comprises: providing a first sub-element comprising in sequence a first metal layer of copper in electrical contact with a second metal layer of aluminum in electrical contact with a third metal layer of copper; etching an electrical circuit design in the first metal layer and in a separate etch step, etching away at least 10%, but less than 100% of the second metal layer to provide electrical connections between the first metal layer and the third metal layer; etching an electrical circuit design into the third metal layer; adhering an etched surface comprising the circuit design of the first or third metal layer to a first surface of a support layer to form a circuit board. The process may etch the first and third metal layers simultaneously or sequentially.