Abstract: A computer-implemented method for securely transferring a secret from a source computing component to a target computing component, wherein the source computing component and the target computing component are part of a secure computing environment is disclosed. The method comprises upon the source computing component receiving from the target computing component a signed attestation document, verifying, by the source computing component, an authenticity and content of the attestation document, and upon a successful verification of the authenticity and the content, transferring, by the source computing component the secret to the target computing system. Thereby, the attestation document is attesting that the target computing component is compliant to an update governance rule.

Abstract: Since lead-tin solder was outlawed, electronic circuits constructed with lead-free tin solders have been plagued growth of whiskers of tin emanating from the tin soldered and/or tin coated surfaces. Such whiskers often short out the electronic circuits when present. The growth of tin whiskers in such electronic circuits (i.e., those fully or partially populated with components is addressed here by depositing a tin-whisker-impenetrable metal cap on all exposed tin coated surfaces in the circuit. In the process, metal surfaces where no cap is desired are masked, where after all exposed metal surfaces are cleaned, followed by immersing the entire circuit in an electroless bath, e.g., a nickel electroless bath, for a time sufficient to form a metal cap on all exposed metal surfaces, removing the circuit from the bath, rinsing and de-masking covered surfaces.

Abstract: Since lead-tin solder was outlawed, electronic circuits constructed with lead-free tin solders have been plagued growth of whiskers of tin emanating from the tin soldered and/or tin coated surfaces. Such whiskers often short out the electronic circuits when present. The growth of tin whiskers in such electronic circuits (i.e., those fully or partially populated with components is addressed here by depositing a tin-whisker-impenetrable metal cap on all exposed tin coated surfaces in the circuit. In the process, metal surfaces where no cap is desired are masked, where after all exposed metal surfaces are cleaned, followed by immersing the entire circuit in an electroless bath, e.g., a nickel electroless bath, for a time sufficient to form a metal cap on all exposed metal surfaces, removing the circuit from the bath, rinsing and de-masking covered surfaces.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.