Patents by Inventor Dennis Grimard
Dennis Grimard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8363378Abstract: Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.Type: GrantFiled: February 17, 2009Date of Patent: January 29, 2013Assignee: Intevac, Inc.Inventors: Terry Bluck, Hizam Sahibudeen, Dennis Grimard
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Publication number: 20120138230Abstract: Systems and methods for moving substrates through process chambers for photovoltaic (PV) or solar cell applications are disclosed. In particular, systems and methods for moving substrates through process chambers using a conveyor belt are disclosed. The conveyor belt can be used to move the substrates through etch chambers, chemical vapor deposition (CVD) chambers, and/or ion implant chambers, and the like.Type: ApplicationFiled: December 6, 2011Publication date: June 7, 2012Inventors: Terry BLUCK, Young Kyu Cho, Dennis Grimard, Karthik Janakiraman, Moon Chun
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Publication number: 20100326602Abstract: An isolator for heat transfer gas conduits of an electrostatic chuck is described. The isolator includes a sleeve and a body positioned in the sleeve to form an annulus between the body and sleeve that allows for flow of the heat transfer gas. The body is positioned against the puck of the chuck, and may be supported in this position by a spring. A silicon seal may be provided between the sleeve and the puck to prevent plasma from forming in the conduits.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Applicant: INTEVAC, INC.Inventors: Terry BLUCK, Terry Pederson, Dennis Grimard
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Publication number: 20100208409Abstract: Systems and methods for optimally dechucking a wafer from an electrostatic chuck are described. The force on a lift-pin mechanism is monitored and a dechuck voltage is determined based on the force. The wafer is dechucked at the determined dechuck voltage.Type: ApplicationFiled: February 17, 2009Publication date: August 19, 2010Applicant: INTEVAC, INC.Inventors: Terry Bluck, Hizam Sahibudeen, Dennis Grimard
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Publication number: 20090086401Abstract: An electrostatic chuck includes an angled conduit, or an angled laser drilled passage, through which a heat transfer gas is provided. A segment of the angled conduit and/or the angled laser drilled passage extends along an axis different from an axis of the electric field generated to hold a substrate to the chuck, thereby minimizing plasma arcing and backside gas ionization. A first plug may be inserted into the conduit, wherein a segment of a first exterior channel thereof extends along an axis different from an axis of the electric field. A first and second plug may be inserted into a ceramic sleeve which extends through at least one of the dielectric member and the electrode. Finally, the surface of the dielectric member may comprise embossments arranged at radial distances from the center of the dielectric member so as to improve heat transfer and gas distribution.Type: ApplicationFiled: September 28, 2007Publication date: April 2, 2009Applicant: INTEVAC, INC.Inventors: Tugrul Samir, Terry Bluck, Dennis Grimard
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Publication number: 20090086400Abstract: An electrostatic chuck for holding a substrate has a circular dielectric member having a top surface configured to support the substrate, the top surface having a plurality of mesas consisting of n subsets, wherein mesas of each subset are distributed along one of a plurality of concentric bolt circles of increasing radii, and wherein all of the concentric bolt circles center about the center of the circular dielectric member.Type: ApplicationFiled: September 28, 2007Publication date: April 2, 2009Applicant: INTEVAC, INC.Inventors: Tugrul Samir, Dennis Grimard
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Patent number: 7431857Abstract: A method and apparatus for generating and controlling a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method includes the steps of supplying a first RF signal from the source to an electrode within the processing chamber at a first frequency and supplying a second RF signal from the source to the electrode within the processing chamber at a second frequency. The second frequency is different from the first frequency by an amount equal to a desired frequency. Characteristics of a plasma formed in the chamber establish a sheath modulation at the desired frequency.Type: GrantFiled: May 12, 2004Date of Patent: October 7, 2008Assignee: Applied Materials, Inc.Inventors: Steven C. Shannon, Alex Paterson, Theodoros Panagopoulos, John P. Holland, Dennis Grimard, Yashushi Takakura
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Publication number: 20070006971Abstract: A method and apparatus for generating and controlling a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method includes the steps of supplying a first RF signal from the source to an electrode within the processing chamber at a first frequency and supplying a second RF signal from the source to the electrode within the processing chamber at a second frequency. The second frequency is different from the first frequency by an amount equal to a desired frequency. Characteristics of a plasma formed in the chamber establish a sheath modulation at the desired frequency.Type: ApplicationFiled: September 13, 2006Publication date: January 11, 2007Applicant: Applied Materials, Inc.Inventors: Steven Shannon, Alex Paterson, Theodoros Panagopoulos, John Holland, Dennis Grimard, Yashushi Takakura
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Publication number: 20070000611Abstract: A method and apparatus for controlling characteristics of a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method comprises supplying a first RF signal to a first electrode disposed in a processing chamber, and supplying a second RF signal to the first electrode, wherein an interaction between the first and second RF signals is used to control at least one characteristic of a plasma formed in the processing chamber.Type: ApplicationFiled: September 11, 2006Publication date: January 4, 2007Applicant: APPLIED MATERIALS, INC.Inventors: Steven Shannon, Dennis Grimard, Theodoros Panagopoulos, Daniel Hoffman, Michael Chafin, Troy Detrick, Alexander Paterson, Jingbao Liu, Taeho Shin, Bryan Pu
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Publication number: 20060266735Abstract: A method for controlling a plasma in a semiconductor substrate processing chamber is provided. The method includes the steps of supplying a first RF signal to a first electrode within the processing chamber at a first frequency selected to cause plasma sheath oscillation at the first frequency; and supplying a second RF signal from the source to the first electrode at a second frequency selected to cause plasma sheath oscillation at the second frequency, wherein the second frequency is different from the first frequency by a differential equal to a desired frequency selected to cause plasma sheath oscillation at the desired frequency.Type: ApplicationFiled: May 2, 2006Publication date: November 30, 2006Applicant: Applied Materials, Inc.Inventors: Steven Shannon, Alexander Paterson, Theodoros Panagopoulos, John Holland, Dennis Grimard, Daniel Hoffman
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Publication number: 20050090118Abstract: A method and apparatus for controlling characteristics of a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method comprises supplying a first RF signal to a first electrode disposed in a processing chamber, and supplying a second RF signal to the first electrode, wherein an interaction between the first and second RF signals is used to control at least one characteristic of a plasma formed in the processing chamber.Type: ApplicationFiled: April 12, 2004Publication date: April 28, 2005Inventors: Steven Shannon, Dennis Grimard, Theodoros Panagopoulos, Daniel Hoffman, Michael Chafin, Troy Detrick, Alexander Paterson, Jingbao Liu, Taeho Shin, Bryan Pu
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Publication number: 20050034816Abstract: A method and apparatus for generating and controlling a plasma in a semiconductor substrate processing chamber using a dual frequency RF source is provided. The method includes the steps of supplying a first RF signal from the source to an electrode within the processing chamber at a first frequency and supplying a second RF signal from the source to the electrode within the processing chamber at a second frequency. The second frequency is different from the first frequency by an amount equal to a desired frequency. Characteristics of a plasma formed in the chamber establish a sheath modulation at the desired frequency.Type: ApplicationFiled: May 12, 2004Publication date: February 17, 2005Inventors: Steven Shannon, Alex Paterson, Theodoros Panagopoulos, John Holland, Dennis Grimard, Yashushi Takakura
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Patent number: 6795292Abstract: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein.Type: GrantFiled: May 15, 2001Date of Patent: September 21, 2004Inventors: Dennis Grimard, Arnold Kholodenko, Alex Veytser, Senh Thach, Wing Cheng
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Publication number: 20040081439Abstract: An apparatus for controlling a temperature of a substrate during semiconductor substrate processing including a semiconductor substrate processing chamber and a substrate support disposed in the chamber. The substrate support includes heater electrode adapted for connection to a power source and disposed within the substrate support, and a meter coupled to the heater electrode for measuring resistivity of the heater electrode as an indicator of the temperature of the heater electrode. A controller is also coupled to the meter and the power source wherein the controller regulates power distribution from the power source to the heater electrode based upon a temperature of the heater electrode, where the temperature is determined from a measured resistivity of the heater electrode.Type: ApplicationFiled: October 24, 2003Publication date: April 29, 2004Applicant: Applied Materials, Inc.Inventors: Arnold Kholodenko, Senh Thach, Dennis Grimard
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Publication number: 20020171994Abstract: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein.Type: ApplicationFiled: May 15, 2001Publication date: November 21, 2002Applicant: Applied Materials, Inc.Inventors: Dennis Grimard, Arnold Kholodenko, Alex Veytser, Senh Thach, Wing Cheng
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Patent number: 6454898Abstract: In accordance with a first aspect of the invention, a plasma reactor having a chamber for containing a plasma and a passageway communicating with the chamber is enhanced with a first removable plasma confinement magnet module placed adjacent the passageway including a first module housing and a first plasma confinement magnet inside the housing. It may further include a second removable plasma confinement magnet module placed adjacent the passageway including a second module housing, and a second plasma confinement magnet. Preferably, the first and second modules are located on opposite sides of the passageway. Moreover, the first and second plasma confinement magnets have magnetic orientations which tend to oppose plasma transport or leakage through the passageway. Preferably, the module housing includes a relatively non-magnetic thermal conductor such as aluminum and is in thermal contact with said chamber body.Type: GrantFiled: January 11, 2000Date of Patent: September 24, 2002Assignee: Applied Materials, Inc.Inventors: Kenneth Collins, Michael Rice, Douglas Buchberger, Craig Roderick, Eric Askarinam, Gerhard Schneider, John Trow, Joshua Tsui, Dennis Grimard, Gerald Yin, Robert Wu
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Patent number: 6074512Abstract: In accordance with a first aspect of the invention, a plasma reactor having a chamber for containing a plasma and a passageway communicating with the chamber is enhanced with a first removable plasma confinement magnet module placed adjacent the passageway including a first module housing and a first plasma confinement magnet inside the housing. It may further include a second removable plasma confinement magnet module placed adjacent the passageway including a second module housing, and a second plasma confinement magnet. Preferably, the first and second modules are located on opposite sides of the passageway. Moreover, the first and second plasma confinement magnets have magnetic orientations which tend to oppose plasma transport or leakage through the passageway. Preferably, the module housing includes a relatively non-magnetic thermal conductor such as aluminum and is in thermal contact with said chamber body.Type: GrantFiled: July 15, 1997Date of Patent: June 13, 2000Assignee: Applied Materials, Inc.Inventors: Kenneth Collins, Michael Rice, Douglas Buchberger, Craig Roderick, Eric Askarinam, Gerhard Schneider, John Trow, Joshua Tsui, Dennis Grimard, Gerald Yin, Robert Wu
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Patent number: 5636098Abstract: An erosion resistant electrostatic chuck 20 for holding a substrate 45 having a peripheral edge 50, in an erosive environment, comprises an electrostatic member 25 including (i) an electrode 30, and (ii) an insulator 35 covering the electrode. A barrier 55 is circumferentially disposed about the electrostatic member 25. The barrier 55 comprises a first contact surface 60 capable of being pressed against the peripheral edge 50 of the substrate 45 to form a seal around the substrate 45 to reduce exposure of the electrostatic member 25 of the chuck 20 to the erosive environment.Type: GrantFiled: May 11, 1995Date of Patent: June 3, 1997Assignee: Applied Materials, Inc.Inventors: Joseph Salfelder, Dennis Grimard, John F. Cameron, Chandra Deshpandey, Robert Ryan, Michael G. Chafin